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北京先楫机器人半导体科技有限公司

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Recent events tied to this brand in public sources.

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  1. 2026

    HPMicro launches HPM53M1 robot joint MCU

    At the 5th Dishui Lake China RISC-V Industry Forum in Shanghai on August 13, 2026, Beijing HPMicro Robotics Semiconductor product director Fei Zhendong officially launched the HPM53M1, a high-performance MCU designed for robot joint CAN communication and motion control. The chip entered mass production in June 2026 and aims to address compute bottlenecks and PCB space constraints in robot joint development; HPMicro also released a complete joint module solution with open hardware schematics and software firmware.

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