Recent events
Recent events tied to this brand in public sources.
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2026
CXMT plans to launch first 4F² architecture server DDR5 RDIMM by end of 2026
ChangXin Memory Technologies (CXMT) revealed plans to launch its first server-grade DDR5 RDIMM memory module using 4F² architecture before the end of 2026, which would put it ahead in the not-yet-commercialized 4F² DRAM technology field. The company claims 33% higher memory cell density versus its G5 node, but has not published detailed specifications, yield data, or customer orders, and industry observers remain cautious about mass-production feasibility.
2026
Changxin Storage announces plan for next-generation DDR5 RDIMM product
Changxin Storage announced that it plans to launch a next-generation DDR5 RDIMM product by the end of 2026.
2026
CXMT releases nine-month 2026 earnings forecast
CXMT released a forecast for the first nine months of 2026, expecting net profit attributable to shareholders of 131 billion yuan to 132.5 billion yuan and revenue of around 265 billion yuan to 270 billion yuan.
2026
CXMT announces 4F² DRAM progress and plans year-end launch of new DDR5 RDIMM with hybrid bonding
At the 4th Integrated Chip and Chiplet Conference recently held in Shanghai, ChangXin Memory Technologies (CXMT) announced key progress in the development of its 4F² DRAM cell structure and said it expects to launch a new-generation DDR5 RDIMM product integrating the 4F² cell structure with hybrid bonding technology by the end of the year.
2026
CXMT to introduce next-generation 4F² DDR5 RDIMM product by end of 2026, about two years ahead of Samsung's roadmap
ChangXin Memory Technologies (CXMT) disclosed new progress in its 4F² DRAM architecture development and previewed a new-generation DDR5 RDIMM product combining the 4F² cell architecture, hybrid bonding and other technologies to be introduced by the end of 2026, which the company positions as about two years ahead of Samsung's roadmap for adopting the same architecture. The product targets the server memory segment rather than low-end consumer memory.
2026
ChangXin Memory begins mass production of LPDDR6 memory
ChangXin Memory announced on August 29 that its LPDDR6 memory has entered mass production, with Xiaomi 18 Fold as the first flagship phone to feature it.
2026
ChangXin Memory Technologies begins mass production of LPDDR6 memory
ChangXin Memory Technologies (CXMT) achieved mass production of its self-developed LPDDR6 memory chip, with peak speed of 12,800 Mbps and up to 16GB capacity, and Xiaomi's 18 Fold will be the first phone to carry it.
2026
Xiaomi unveils three self-developed XRing chips
Xiaomi unveiled three self-developed chips under its XRing brand at a technology briefing in Beijing: the XRing O3 flagship AI SoC for smartphones, the XRing O100 high-bandwidth AI accelerator, and the XRing D100 intelligent driving chip. All three have completed tape-out verification, with the O3 set to debut in September on the Xiaomi 18 Fold and the O100 and D100 scheduled for commercial deployment in 2027.
2026
Xiaomi unveils XRING O3 flagship mobile processor
Xiaomi unveiled its second-generation self-developed flagship system-on-chip, the XRING O3, on Aug. 24. The chip is manufactured on TSMC's 3-nanometer N3P process, is promoted as the world's first mobile processor to support LPDDR6 memory, and achieved an AnTuTu v11 benchmark score exceeding 5.22 million points. It will debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max, both scheduled for release in September.
2020
Maxsun and Changxin Storage launch Taiji G3 DDR4 memory
Maxsun and Changxin Storage jointly released the Taiji G3 3000MHz DDR4 memory series. The article says it is a domestically produced product.
2020
FORESEE launches three DDR4 memory products
FORESEE launched three memory products: DDR4 SODIMM 8GB, DDR4 UDIMM 8GB, and DDR4 UDIMM 16GB. Their DRAM chips are supplied by ChangXin Memory Technologies.
2020
ChangXin and Rambus announce DRAM technology license
ChangXin announced an agreement with Rambus under which ChangXin obtained a license to Rambus DRAM technology; the specific terms and licensing fee were not disclosed.
2020
ChangXin lists DDR4 and LPDDR4X memory products
ChangXin listed its DDR4 memory chips, DDR4 memory modules, and LPDDR4X memory chips on its official website and began accepting technical and sales inquiries for the products.