ACM Research

ACM Research, Inc. is a semiconductor manufacturing equipment company founded in California in 1998. It supplies capital equipment to the global semiconductor industry and develops, manufactures, and supports its products through subsidiaries in Shanghai, China, and Inchon, South Korea. Its global sales and service organization supports customers in Asia, North America, and Europe. The available company description does not specify a precise headquarters address. The company’s portfolio serves IC and compound-semiconductor manufacturing, wafer-level and panel-level packaging, and wafer manufacturing. Equipment and process categories include single-wafer and batch wet cleaning, electrochemical plating, thermal deposition, stress-free polishing, PECVD, ALD, and track systems. ACM Research describes its tools as customized, high-performance and sustainable solutions intended to improve productivity, efficiency, and manufacturing yield while keeping cost of ownership low. A central area of the company’s technology offering is wet processing. Its site highlights proprietary Smart Megasonix, SAPS (Space Alternated Phase Shift), and TEBO cleaning technologies, along with cleaning, plating, coating, developing, stripping, wet etching, and polishing systems. Its advanced-packaging equipment is presented for applications such as fan-out wafer-level packaging, 2.5D interposers, 3D stacks, and chiplet architectures. The company also offers specialized tools for panel-level packaging and other manufacturing processes. ACM Research presents its customer relationships, process customization, intellectual property, and service support as important parts of its offering. Its company page reports a portfolio of more than 448 internationally granted patents and says its tools support processing requirements for wafers up to 12 inches. ACM Research, Inc. is publicly traded under the ticker ACMR. The supplied materials identify its U.S. corporate origin and its Shanghai and South Korean subsidiaries, but do not establish detailed ownership, executive, or corporate-parent information.

ACM Research, Inc. was founded in California in 1998 to supply capital equipment to the global semiconductor industry. The company’s development has centered on equipment and process technologies for semiconductor manufacturing, with a portfolio that now addresses IC and compound-semiconductor production, wafer manufacturing, and advanced packaging. The supplied company materials do not identify the original founders or describe the earliest product launches, so those details cannot be established here. The company operates through subsidiaries in Shanghai, China, and Inchon, South Korea, which the company identifies as locations for product development, manufacturing, and product support. It also describes a global sales and service organization serving customers across Asia, North America, and Europe. This structure connects its California-founded business with manufacturing and support operations in East Asia and a wider customer base. ACM Research’s product range spans multiple semiconductor process steps. Its company overview lists single-wafer and batch wet cleaning, electrochemical plating, thermal deposition, stress-free polishing, PECVD, ALD, and track equipment. The company says its tools support advanced technology-node requirements and wafer sizes up to 12 inches. It also emphasizes customized equipment and process solutions, customer collaboration, productivity, efficiency, yield, and cost of ownership. Wet cleaning and wet processing are prominent parts of the company’s technology story. Its website identifies Smart Megasonix and describes SAPS, or Space Alternated Phase Shift, as a proprietary approach using alternating phases of megasonic waves to deliver uniform cleaning energy across flat and patterned wafer surfaces. The site also names TEBO technology. The available materials do not establish the dates on which these technologies or individual tool families were first introduced. The company has extended its equipment offering to wafer-level and panel-level packaging. Its packaging materials describe tools for cleaning, plating, coating, developing, stripping, and wet etching, and reference applications including fan-out wafer-level packaging, 2.5D interposers, 3D stacks, and chiplet architectures. A packaging page describes customized single-wafer equipment and systems for plating pillars, bumps, and redistribution layers. The company’s broader portfolio also includes solutions for compound semiconductors and wafer manufacturing. ACM Research reports that its intellectual-property portfolio includes more than 448 internationally granted patents. It presents technical innovation, customer collaboration, and worldwide service and support as part of its market proposition. ACM Research, Inc. is publicly traded under the ticker ACMR. Beyond its 1998 founding and the operational footprint described above, the supplied evidence does not establish dated milestones such as an IPO, acquisitions, leadership changes, or individual product launch dates.

• 1998

  Founded in California

A semiconductor equipment and process-technology supplier offering customized tools for high-volume manufacturing, advanced wafer processing, and packaging applications.

• Wet-cleaning systems

  Single-wafer and batch wet-cleaning equipment, including systems associated with the company’s Smart Megasonix, SAPS, and TEBO technologies.

• Electrochemical plating systems

  Plating equipment for semiconductor manufacturing and packaging processes, including wafer-level packaging applications.

• Stress-free polishing systems

  Stress-free polishing equipment included in the company’s semiconductor process portfolio.

• Wafer-level packaging systems

  Equipment for cleaning, plating, coating, developing, stripping, and wet etching in wafer-level packaging workflows.

• 2024

  Added to U.S. Entity List

  On December 2, 2024, the U.S. BIS added ACM Research Shanghai and its Beijing, Wuxi, and South Korean subsidiaries to the Entity List. The company said it had established a diversified supply chain and that the impact was controllable, and in January 2025 it terminated a 245 million yuan investment in South Korea. Added to Entity List.

  Source

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• Establishment of subsidiaries in Shanghai, China and Inchon, South KoreaOther

  Source

• Development of a multi-product portfolio for high-volume IC fab productionOther

  Source

• Commitment to global sales and service organizationOther

  Source

• 2021.08.05

  Reported2021.08.06

  ACM Research launches Bevel Etch product[8]ACM Research推出Bevel Etch产品eejournal.com

  ACM Research announced the launch of its Bevel Etch product, a wet-etch tool for removing films and particulate contaminants from wafer edges.

• 2019.12.03

  ACM Research announces Ultra C Tahoe commercial availability[9]ACM Research宣布Ultra C Tahoe商业上市nanotech-now.com

  ACM Research announced the global commercial availability of its Ultra C Tahoe wafer-cleaning system, which combines bench and single-wafer cleaning in an integrated system.

Read more

1. 1ACM Research | Wafer Fabrication Equipment (WFE) & Systemsacmr.com
2. 2ACMR | High-Volume IC Fab Production | ACM Researchacmr.com
3. 3Advanced Systems and Tools for Wafer Level Packaging (WLP)acmr.com
4. 4ACM Research News regarding advanced wafer cleaningacmr.com
5. 5ACM Research | Wafer Fabrication Equipment (WFE) & Systemsacmr.com
6. 6Added to U.S. Entity Listnbd.com.cn
7. 7Added to U.S. Entity Listfinance.sina.com.cn
8. 8ACM Research推出Bevel Etch产品eejournal.com
9. 9ACM Research宣布Ultra C Tahoe商业上市nanotech-now.com
10. 10ACM Research Enters Dry Processing Market with Launch of Ultra Furnace - Embedded Computing Designembeddedcomputing.com