Recent events
Recent events tied to this brand in public sources.
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2026
NVIDIA and supply chain partners announce manufacturing capacity expansion plans
NVIDIA announced plans with supply chain partners to expand manufacturing capacity across substrates, advanced packaging, semiconductor testing and optical engines. The reported expansions include facilities and operations in the United States, Japan, South Korea, Taiwan and Singapore.
2021
Samsung launches H-Cube advanced packaging solution
Samsung launched H-Cube, a 2.5D packaging solution intended for high-performance computing, artificial intelligence, data-centre and networking products. The solution was jointly developed by Samsung Electro-Mechanics and Amkor Technology.