Amkor Technology
A global provider of outsourced semiconductor packaging, assembly, and testing services.
Last updated August 31, 2026
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Overview
Amkor Technology is a United States-headquartered provider of outsourced semiconductor assembly and test services, commonly abbreviated as OSAT. Rather than selling consumer-facing processors or memory products under its own name, the company works behind the scenes for semiconductor manufacturers, fabless chip companies, integrated device manufacturers, and system companies. Its work covers the back end of semiconductor production: packaging the silicon die, assembling it into a usable device, and testing the finished product for electrical performance, reliability, and production quality. The company was founded in 1968 by Joo-Jin Kim, also known as James Kim, who established Amkor Electronics in Philadelphia after the transformation of the Kim family's South Korean business into a semiconductor enterprise. The name Amkor is described by the company as a combination of “America” and “Korea.” Semiconductor production and exports began in 1970. Over time, Amkor developed from an early electronics and assembly operation into one of the largest independent packaging and test providers in the global semiconductor supply chain. Amkor's capabilities span traditional and advanced packaging. Its service portfolio includes wire bonding, flip-chip packaging, copper-pillar interconnections, wafer-level packaging, system-in-package integration, radio-frequency and antenna-in-package solutions, CMOS image-sensor packaging, thermal-compression assembly, and semiconductor test services. It also provides packaging design and engineering support, allowing customers to move from package concept and process development through high-volume manufacturing and final test. Some services address miniaturization and high-density interconnection, while others are designed for automotive, mobile communications, consumer electronics, computing, industrial, and other demanding applications. The company's manufacturing footprint has expanded across Asia, Europe, and North America. Its facilities and operations have included sites in China, Japan, South Korea, Malaysia, the Philippines, Portugal, Taiwan, Vietnam, and the United States. This geographic distribution allows Amkor to support customers close to major wafer-fabrication, electronics-assembly, and end-market centers, while also providing supply-chain diversification. The company moved its headquarters from West Chester, Pennsylvania, to Arizona in 2005; the Arizona headquarters was initially in Chandler and later moved to Tempe. Amkor became publicly traded on Nasdaq in 1998. Its growth has included acquisitions and expansion into additional packaging and test technologies. The company acquired United States OSAT provider Integra Technologies in 2000 and later spun that business off in 2005. In 2016, it completed the acquisition of J-Devices, a major Japanese outsourced assembly and test provider. Amkor also expanded its Taiwan manufacturing presence with a plant at Longtan Science Park, which opened in 2018. Amkor's competitive position rests on its scale, process know-how, engineering resources, test capacity, and ability to support increasingly complex chip architectures. As semiconductor designers use more heterogeneous integration, chiplets, advanced interconnects, and compact multi-die packages, packaging has become an increasingly important part of system performance and product differentiation. Amkor therefore occupies a critical manufacturing position between wafer fabrication and the incorporation of semiconductor devices into finished electronic systems. The company remains an active, internationally oriented semiconductor manufacturing-services brand rather than a conventional consumer electronics brand.
History
Amkor Technology's history is connected to the development of South Korea's early semiconductor industry and to the international division of labor that emerged in electronics manufacturing. The Kim family business began in Seoul in 1935 as ANAM Industries, which handled imported Japanese goods, including bicycles. In March 1968, the business was reorganized as ANAM Industrial Co. Ltd., described in reference material as South Korea's first semiconductor company. The following month, Joo-Jin Kim, known as James Kim, founded Amkor Electronics, Inc. and opened a sales office in Philadelphia. The Amkor name reflects the company's cross-border origins, combining references to America and Korea. Semiconductor production and exports began in 1970. The company's early role developed alongside the increasing separation of semiconductor design, wafer fabrication, packaging, assembly, and testing. As integrated device manufacturers sought to outsource labor-intensive and technically specialized back-end operations, independent providers such as Amkor became important links between wafer production and finished electronic products. Amkor gradually broadened its process capabilities beyond conventional assembly. It developed and commercialized services involving wire bonding, flip-chip interconnection, wafer-level packaging, system-in-package integration, radio-frequency and antenna-related packaging, CMOS image sensors, copper-pillar bumps, and other advanced packaging structures. Its testing operations became a complementary part of the offering, enabling customers to qualify and screen packaged integrated circuits before shipment. The company entered the public markets on Nasdaq in 1998. In 2000, it acquired Integra Technologies, a United States outsourced semiconductor assembly and test provider. Integra was subsequently spun off by Amkor in 2005. That same year, Amkor moved its corporate headquarters from West Chester, Pennsylvania, to Arizona. The headquarters was first located in Chandler and later relocated to Tempe, where the company remains headquartered. International expansion has been central to Amkor's operating model. The company established or maintained manufacturing, engineering, and customer-support operations in a number of semiconductor-producing and electronics-manufacturing regions, including China, Japan, South Korea, Malaysia, the Philippines, Portugal, Taiwan, Vietnam, and the United States. This network supports both regional customer service and production diversification. In February 2016, Amkor completed the full acquisition of J-Devices Corp., described in reference material as Japan's largest OSAT provider. The transaction strengthened Amkor's Japanese presence and added local assembly and test capabilities. In 2017, Qualcomm Technologies named Amkor Supplier of the Year for 2016 for the second consecutive year, reflecting the importance of packaging and testing performance in major chip-company supply chains. Amkor opened a manufacturing and test plant at Taiwan's Longtan Science Park in September 2018. The expansion added capacity in a major semiconductor ecosystem and supported the company's broader strategy of locating operations near wafer foundries, chip designers, and electronics manufacturers. In 2019, Amkor was ranked second in the OSAT market by overall revenue in the cited industry comparison. In the broader semiconductor industry, Amkor's role has become more strategically important as packaging has evolved from a largely downstream assembly task into a major source of system integration, power management, form-factor reduction, and performance improvement. Advanced packaging can combine multiple dies or functions in a single package and can support chiplet-based architectures, high-density interconnects, and applications with demanding thermal and reliability requirements. Amkor continues to operate as a manufacturing and engineering partner rather than as a branded chip vendor. Its present business is centered on designing package solutions, assembling semiconductor devices, and testing products for customers across automotive, communications, consumer, computing, and industrial markets.
- 2019
Amkor ranks second in OSAT revenue
[1]An industry comparison placed Amkor second by overall revenue in the outsourced semiconductor assembly and test market.
- 2018
Taiwan Longtan facility opens
[1]Amkor opened a manufacturing and test facility at Longtan Science Park in Taiwan.
- 2017
Qualcomm Supplier of the Year recognition
[1]Qualcomm Technologies recognized Amkor as Supplier of the Year for 2016 for a second consecutive year.
- 2016
J-Devices acquisition completed
[1]Amkor completed its full acquisition of Japanese OSAT provider J-Devices Corp.
- 2005
Headquarters moves to Arizona
[1]Amkor moved its headquarters from West Chester, Pennsylvania, to Arizona, first locating it in Chandler and later in Tempe.
- 2005
Integra Technologies is spun off
[1]Amkor spun off Integra Technologies after the earlier acquisition.
- 2000
Integra Technologies acquisition
[1]Amkor acquired United States OSAT provider Integra Technologies.
- 1998
Amkor begins Nasdaq trading
[1]Amkor became a publicly traded company on Nasdaq.
- 1970
Semiconductor production and exports begin
[1]Amkor began semiconductor production and export operations.
- 1968
Amkor Electronics is founded
[3]Joo-Jin (James) Kim founded Amkor Electronics, Inc. and opened a sales office in Philadelphia.
Products and positioning
A global outsourced semiconductor assembly and test partner for chip designers, semiconductor manufacturers, and system companies, with emphasis on advanced packaging, high-volume manufacturing, reliability, and geographically distributed production capacity.
Semiconductor packaging
Advanced Packaging
Advanced packaging services for complex and highly integrated semiconductor devices. These services can combine multiple dies or functions, support high-density interconnection, and address requirements such as smaller form factors, improved electrical performance, thermal management, and system-level integration.
Semiconductor packaging
Flip-Chip Packaging
Packaging based on direct flip-chip interconnection between the semiconductor die and package substrate. Amkor's flip-chip capabilities include structures using copper-pillar bumps and are intended for applications requiring compact packages, dense interconnects, and strong electrical performance.
Semiconductor packaging
Wafer-Level Packaging
Packaging processes performed partly or substantially at wafer level before individual devices are separated. Wafer-level approaches can help reduce package size, support scalable manufacturing, and serve integrated circuits whose applications place a premium on compact dimensions.
System integration
System-in-Package
System-in-package services integrate multiple dies, components, or functional blocks into a single package. The approach allows customers to combine processing, memory, sensing, radio-frequency, or other functions within a constrained footprint for communications, computing, consumer, and industrial products.
Semiconductor packaging
Wire-Bond Packaging
Wire-bond assembly connects semiconductor dies to package leads or substrates using fine wires. It remains an important high-volume packaging method across many device categories and can be adapted to different package formats, reliability requirements, and production volumes.
Radio-frequency semiconductor packaging
RF and Antenna Packaging
Packaging and design services for radio-frequency devices, including solutions in which antenna structures are incorporated directly into or onto a semiconductor package or related module. These offerings support compact wireless and communications products.
Imaging semiconductor packaging
CMOS Image-Sensor Packaging
Packaging services for CMOS image sensors, supporting the mechanical, optical, electrical, and reliability requirements of imaging devices used in consumer, mobile, automotive, and industrial applications.
Semiconductor testing
Semiconductor Test Services
Electrical, performance, and reliability testing for semiconductor devices before and after assembly. Testing services help customers verify device functionality, screen production output, qualify package designs, and prepare finished components for shipment.
Brand decisions
2018
Expansion at Taiwan Longtan Science ParkStrategyBackground
Taiwan is a major center for semiconductor fabrication, design, and electronics manufacturing.
Action taken
Amkor opened a manufacturing and test plant at Longtan Science Park.
Aftermath
The facility expanded Amkor's regional production and customer-support capacity.
2016
Full acquisition of J-DevicesM&ABackground
Japan was an important semiconductor and electronics market, and J-Devices provided an established local OSAT platform.
Action taken
Amkor completed the full acquisition of J-Devices Corp.
Aftermath
The transaction strengthened Amkor's Japanese assembly and test presence.
2005
Headquarters relocation to ArizonaStrategyBackground
Amkor reorganized its corporate footprint as its operations and customer base became increasingly international.
Action taken
The company moved its headquarters from West Chester, Pennsylvania, to Arizona, eventually establishing the headquarters in Tempe.
Aftermath
Tempe became Amkor's continuing corporate headquarters.
2000
Acquisition of Integra TechnologiesM&ABackground
Amkor sought to expand its outsourced semiconductor assembly and test capabilities in the United States.
Action taken
The company acquired Integra Technologies, a United States OSAT provider.
Aftermath
Integra was later spun off in 2005.
Recent events
- Unconfirmed
NVIDIA and supply chain partners announce manufacturing capacity expansion plans[4]
NVIDIA announced plans with supply chain partners to expand manufacturing capacity across substrates, advanced packaging, semiconductor testing and optical engines. The reported expansions include facilities and operations in the United States, Japan, South Korea, Taiwan and Singapore.
Reported
Samsung launches H-Cube advanced packaging solution[5]
Samsung launched H-Cube, a 2.5D packaging solution intended for high-performance computing, artificial intelligence, data-centre and networking products. The solution was jointly developed by Samsung Electro-Mechanics and Amkor Technology.
Sources5 sources
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