ASE Group

ASE Group, associated with Advanced Semiconductor Engineering, Inc., is a Taiwan-based semiconductor services company focused on outsourced semiconductor assembly and test manufacturing. Its headquarters and principal operating base are in Kaohsiung, where brothers Jason Chang and Richard Chang established the business in 1984. Rather than manufacturing semiconductor wafers in the same way as an integrated device manufacturer or foundry, ASE operates primarily in the back-end portion of semiconductor production: assembling dies into packages, connecting them to substrates or leadframes, testing finished or partially finished devices, and providing related engineering and electronic manufacturing services. The company serves a broad international electronics customer base. Its activities support products used in mobile devices, wireless communications, computers, servers, consumer electronics, automotive systems, industrial equipment, graphics hardware, wearables, and Internet of Things products. ASE's manufacturing and service footprint extends beyond Taiwan to facilities or operations in China, South Korea, Japan, Malaysia, and Singapore, with additional offices and service centers in several of those markets as well as Belgium and the United States. ASE's technology portfolio includes fan-out wafer-level packaging, wafer-level chip-scale packaging, flip-chip packaging, 2.5D and 3D packaging, system-in-package integration, and copper-wire bonding. These technologies address the industry's need for smaller packages, higher interconnect density, improved electrical performance, and the integration of multiple chips or components into compact modules. Wafer-level chip-scale packaging is used to produce very thin packages for portable electronics, while system-in-package technology combines multiple integrated circuits and other components in one package for applications such as wearables, mobile devices, and IoT products. Advanced 2.5D and 3D approaches are relevant to high-performance computing, graphics, networking, and high-bandwidth memory applications. ASE has also participated in the development of advanced packaging with major chip and system companies. Its work with AMD on 2.5D packaging contributed to the packaging of AMD's Fiji graphics processor, which was publicly introduced in 2015. The company's packaging capabilities have helped position it within the global outsourced semiconductor assembly and test, or OSAT, industry. Reference material citing Gartner identifies ASE as the world's largest OSAT provider by market share, although market-share figures vary by methodology and reporting period. The group has expanded both its technology capacity and environmental infrastructure. It began volume production of wafer-level chip-scale packages in 2001 and was among the early large-scale producers of system-in-package products in 2004. It also invested in wastewater treatment and recycling after an industrial-water incident at its K7 facility in Kaohsiung in 2013. The K7 plant was subject to regulatory review and was permitted to resume operations after authorities assessed improvements to its wastewater treatment systems. ASE subsequently developed the K14 water-recycling plant, which entered trial operation in 2015. In 2016, ASE and Siliconware Precision Industries announced an agreement to create a new holding-company structure as part of consolidation in the semiconductor packaging and testing sector. The announcement stated that the two businesses would retain their legal entities, management, employees, independent operations, and operating models. This transaction was a major strategic development in the company's history and reflected the increasing scale and capital intensity of advanced semiconductor packaging. ASE remains associated with the global semiconductor supply chain through its packaging, testing, and related manufacturing services.

ASE Group was established in 1984 by brothers Jason Chang and Richard Chang, who opened the company's first factory in Kaohsiung, Taiwan. The business developed around semiconductor back-end manufacturing, a segment that supports chip producers after wafer fabrication by assembling, packaging, and testing semiconductor devices. This specialization allowed ASE to serve multiple semiconductor and electronics companies without being tied to one branded chip product. The company expanded its technology base as semiconductor products became smaller and more complex. ASE began volume production of wafer-level chip-scale packages in October 2001. This packaging method places the package at wafer scale and supports very thin devices, making it relevant to mobile phones and other compact electronics. In 2004, ASE became one of the early companies to mass-produce system-in-package products. SiP technology brings multiple integrated circuits or functional components together in a single package and became increasingly important for mobile, wearable, and IoT applications. ASE also invested in flip-chip and advanced wafer-level technologies. Fan-out wafer-level packaging enabled thinner, high-density packages without relying on the same package footprint as conventional wafer-level chip-scale packaging. The company additionally developed 2.5D and 3D packaging capabilities for applications requiring dense interconnections and the combination of processing, memory, and other semiconductor functions. ASE began working with AMD on 2.5D packaging in 2007. That collaboration later supported AMD's Fiji graphics processor, publicly launched in 2015, demonstrating the use of advanced packaging in high-performance graphics hardware. During the 2010s, ASE expanded its production and service network across Asia and established customer-facing operations in Europe and North America. The group operated plants in Taiwan, China, South Korea, Japan, Malaysia, and Singapore. Its growth occurred as outsourced semiconductor assembly and test became more strategically important to chip designers, foundries, integrated device manufacturers, and electronics brands seeking specialized packaging capacity. Environmental infrastructure became a significant operational issue after an incident involving water at the K7 facility on 1 October 2013. Kaohsiung authorities and the city's Environmental Protection Bureau later reviewed the factory and its wastewater-treatment improvements. The facility was permitted to resume operations in December 2014 after regulatory assessment. ASE reported substantial investment in industrial-water treatment between 2010 and 2013 and later built the K14 water-recycling plant in Kaohsiung. The plant began trial operation in January 2015; its first phase was designed to process up to 20,000 metric tons of wastewater per day, recycle approximately half for facility use, and discharge treated remainder in accordance with applicable requirements. A major structural development came on 26 May 2016, when ASE and Siliconware Precision Industries announced an agreement to create a new holding-company arrangement. The proposal reflected consolidation in the global semiconductor packaging and testing market. The companies stated that they would retain their legal entities, management, employees, independent operations, and operating models. The arrangement linked two major Taiwan-based OSAT businesses while preserving operational continuity. ASE's present identity is therefore rooted in a combination of large-scale manufacturing, international customer coverage, and advanced packaging expertise. Its offerings span traditional assembly and testing as well as increasingly sophisticated wafer-level, system-in-package, flip-chip, 2.5D, and 3D solutions. These capabilities support electronics markets in which performance, power efficiency, package size, and the integration of multiple semiconductor functions are increasingly important.

• 2016

  ASE and SPIL announce a holding-company agreement

  [1]ASE Groupen.wikipedia.org

  ASE and Siliconware Precision Industries announce a consolidation structure while retaining separate operating entities and management.

• 2015

  K14 water-recycling plant enters trials

  [1]ASE Groupen.wikipedia.org

  ASE begins trial operation of a large water-recycling facility in Kaohsiung.

• 2015

  AMD Fiji graphics processor is launched

  [1]ASE Groupen.wikipedia.org

  AMD launches Fiji, a graphics processor using 2.5D packaging developed with ASE involvement.

• 2014

  K7 is cleared to resume operations

  [1]ASE Groupen.wikipedia.org

  Kaohsiung environmental officials approve resumption after reviewing improvements to the facility's wastewater treatment.

• 2013

  K7 water incident

  [1]ASE Groupen.wikipedia.org

  A water-related incident occurs at ASE's K7 facility in Kaohsiung, leading to subsequent regulatory review.

• 2007

  2.5D packaging collaboration with AMD begins

  [1]ASE Groupen.wikipedia.org

  ASE begins working with AMD on bringing 2.5D semiconductor packaging technology to market.

• 2004

  ASE begins mass production of system-in-package products

  [1]ASE Groupen.wikipedia.org

  The company becomes an early large-scale producer of system-in-package technology, integrating multiple functions in one package.

• 2001

  Volume production of wafer-level chip-scale packages begins

  [1]ASE Groupen.wikipedia.org

  ASE begins volume production of wafer-level chip-scale packaging for thin, compact semiconductor devices.

• 1984

  ASE is founded in Kaohsiung

  [1]ASE Groupen.wikipedia.org

  Jason Chang and Richard Chang establish the company and open its first factory in Kaohsiung, Taiwan.

A large-scale, independent outsourced semiconductor assembly and test provider serving global electronics and semiconductor companies, with emphasis on advanced packaging, miniaturization, heterogeneous integration, and high-volume manufacturing.

• Semiconductor packaging · 2001

  Wafer-level chip-scale packaging

  Wafer-level chip-scale packaging produces packages close to the dimensions of the semiconductor die and supports very thin, compact devices. ASE began volume production of this technology in 2001. It is particularly suited to portable consumer electronics, including mobile devices, where reduced package thickness and efficient use of board space are important.

• Advanced semiconductor packaging

  Fan-out wafer-level packaging

  Fan-out wafer-level packaging extends package interconnections beyond the area of the original die, allowing high-density connections in a thin package. The technology is used to address miniaturization and performance requirements in mobile, wireless, and other compact electronic products.

• Semiconductor packaging

  Flip-chip packaging

  Flip-chip packaging turns the semiconductor die face down so its electrical connections can be attached directly to a substrate or leadframe. This approach can provide short electrical paths and high interconnect density, supporting mobile and wireless devices, computing systems, servers, and consumer electronics.

• Advanced semiconductor packaging

  2.5D and 3D packaging

  ASE's 2.5D and 3D packaging technologies enable dense interconnection and the integration of multiple semiconductor elements in a limited package area. They are relevant to high-bandwidth memory, graphics processors, networking equipment, routers, and high-performance computing. ASE's collaboration with AMD on the Fiji graphics processor demonstrated one commercial application of 2.5D packaging.

• Semiconductor integration · 2004

  System-in-package

  System-in-package technology combines multiple integrated circuits and related components in one package so that they can operate as a unified module. ASE was among the early companies to mass-produce SiP products, beginning in 2004. The technology supports wearables, mobile products, IoT devices, and other applications that need several functions in a small footprint.

• Outsourced semiconductor manufacturing · 1984

  Semiconductor assembly and testing

  ASE provides outsourced semiconductor assembly and test services for global electronics and semiconductor customers. The service covers packaging, electrical and reliability testing, and related manufacturing support after wafer fabrication. It is the central business offering around which the group's specialized packaging technologies and international production network are organized.

• 2013

  K7 industrial-water incident

  A water-related incident occurred at ASE's K7 facility in Kaohsiung on 1 October 2013. The matter led to review by Kaohsiung municipal and environmental authorities. ASE subsequently reported investments in industrial-water treatment and built the K14 recycling facility; the K7 plant was allowed to resume operations after officials assessed treatment improvements.

  Source

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• 2016

  Agreement with Siliconware Precision IndustriesM&A

  Background

  The semiconductor packaging and testing industry was undergoing consolidation as customers demanded greater scale and advanced technology.

  Action taken

  ASE and Siliconware Precision Industries announced an agreement to form a new holding-company structure while retaining their legal entities, management, staff, and independent operating models.

  Aftermath

  The agreement represented a major strategic consolidation involving two leading Taiwan-based OSAT businesses.

  Source

• 2015

  Expansion of system-in-package capacityProduct launch

  Background

  Demand for SiP technology was being driven by mobile devices, wearables, and connected products.

  Action taken

  ASE planned to double its SiP production capacity over the following three years.

  Aftermath

  The plan indicated a strategic emphasis on advanced packaging and module integration.

  Source

• 2004

  Mass production of system-in-package technologyProduct launch

  Background

  Product designers increasingly needed to combine several semiconductor functions in small modules.

  Action taken

  ASE became one of the early companies to begin mass production of system-in-package products.

  Aftermath

  SiP became an important offering for mobile, wearable, and IoT applications.

  Source

• 2001

  Begin volume production of wafer-level chip-scale packagingProduct launch

  Background

  Portable electronics were increasing demand for thinner packages and more efficient use of board space.

  Action taken

  ASE began volume production of wafer-level chip-scale packages.

  Aftermath

  The technology became part of ASE's advanced packaging portfolio for compact electronic products.

  Source

1. 1ASE Groupen.wikipedia.org