BESTECHNIC

BESTECHNIC (恒玄科技, often abbreviated BES) is a Chinese fabless semiconductor company founded in 2015 and headquartered in Shanghai. It designs ultra-low-power wireless computing system-on-chip (SoC) solutions, focusing on three core technology areas: wireless communication, intelligent audio/video, and ultra-low-power SoC architecture. The company positions itself as a leading global supplier of such chips, serving major terminal brands worldwide. BESTECHNIC's product portfolio spans smart audio chips (for wireless earbuds, wireless speakers, wireless microphones, gaming audio, and Type-C audio), smart wearable chips, smart hardware chips, and wireless connectivity chips. The company provides full-stack self-developed technology from chip hardware to system software, covering RF/analog/power management circuits, wireless communication, acoustic audio algorithms, image intelligence and vision, high-efficiency NPU, and ultra-low-power SoC architecture. It also offers complete software protocol stack development and deep adaptation to complex operating systems, delivering turnkey chip solutions. The company has achieved several industry firsts, including the world's first dual-mode Bluetooth earbud chip with integrated active noise cancellation (2016), the world's first 28nm low-power smart Bluetooth audio chip BES2300 series (2018), and the industry's first RTOS-based smart speaker chip (2020). It listed on the STAR Market (科创板) of the Shanghai Stock Exchange on December 16, 2020. In 2023 it launched the 6nm ultra-low-power smart wearable SoC BES2800 series, and in 2025 it expanded into smart glasses, wireless microphones, and smart conference assistants. BESTECHNIC's corporate culture emphasizes teamwork ("全队一个球"), with a mission to "build a smart life of interconnected everything" and a vision to become "the most innovative SoC chip company."

BESTECHNIC (恒玄科技) was founded in 2015 as a fabless semiconductor company focused on ultra-low-power wireless computing SoCs. From its inception, the company concentrated on three core technology domains: wireless communication, intelligent audio/video, and ultra-low-power SoC architecture. In 2016, the company released the world's first dual-mode Bluetooth earbud chip with integrated active noise cancellation (ANC). This was followed in 2017 by a new-generation TWS Bluetooth audio chip supporting binaural call functionality. 2018 marked a significant milestone with the launch of the BES2300 series, the world's first low-power smart Bluetooth audio chip using a 28nm advanced process, integrating industry-leading all-digital hybrid active noise cancellation on a single chip. In 2019, BESTECHNIC introduced the BES2300ZP, a new-generation 28nm smart audio TWS earbud chip featuring the company's self-developed next-generation Bluetooth true wireless patented technology (IBRT), significantly improving TWS earbud product experience. The company also obtained Google Voice Assistant BISTO certification. On December 16, 2020, BESTECHNIC listed on the STAR Market (科创板) of the Shanghai Stock Exchange. That same year, it launched the industry's first RTOS-based smart speaker chip, integrating Wi-Fi/BT and far-field voice noise reduction on a single chip, and debuted in Alibaba's Tmall Genie. In 2021, the company launched its first-generation sports watch chip, the BES2500 series, integrating dual-mode Bluetooth, display, and audio functions on a single chip, achieving mass production with leading brand customers. It also introduced the industry's first TWS earbud single chip integrating in-ear detection, noise cancellation, and Bluetooth functions, further strengthening its technological barriers in TWS earbud miniaturization and high integration. In 2022, the 12nm BES2700 series flagship wearable main control chip entered mass production, delivering high performance and ultra-low power consumption, with volume shipments to leading customers. In 2023, BESTECHNIC launched the 6nm ultra-low-power smart wearable SoC chip, the BES2800 series. In 2025, the company expanded into new markets including smart glasses, wireless microphones, and smart conference assistants, continuously broadening its application areas.

• 2025

  Expanded into smart glasses, wireless microphones, and smart conference assistants

• 2023

  Launched 6nm ultra-low-power smart wearable SoC BES2800 series

• 2022

  12nm BES2700 series flagship wearable main control chip entered mass production

• 2021

  Launched first-generation sports watch chip BES2500 series; introduced industry's first TWS earbud single chip integrating in-ear detection, ANC, and Bluetooth

• 2020

  Listed on STAR Market on December 16; launched industry's first RTOS-based smart speaker chip, debuting in Alibaba Tmall Genie

• 2019

  Launched BES2300ZP with self-developed IBRT technology; obtained Google Voice Assistant BISTO certification

• 2018

  Launched BES2300 series, world's first 28nm low-power smart Bluetooth audio chip with all-digital hybrid ANC

• 2017

  Launched new-generation TWS Bluetooth audio chip supporting binaural call functionality

• 2016

  Released world's first dual-mode Bluetooth earbud chip with integrated active noise cancellation

• 2015

  Company founded

A globally leading designer of ultra-low-power wireless computing SoC chips, offering fully self-developed, one-stop turnkey chip solutions.

• Smart audio chips

  Chips for wireless earbuds, wireless speakers, wireless microphones, gaming audio, and Type-C audio.

• Smart wearable chips

  SoCs for smartwatches and wearables, including BES2500, BES2700, and BES2800 series.

• Smart hardware chips

  Chips for smart home and IoT devices.

• Wireless connectivity chips

  Wireless communication chips.

• 2021.05.27

  Hengxuan Technology appoints Li Guangping as board secretary[5]恒玄科技聘任李广平为董事会秘书nbd.com.cn

  Hengxuan Technology announced that Zhao Guoguang had applied to resign as board secretary due to an internal work adjustment and that Li Guangping would be appointed to the role; Zhao would remain the company's vice chairman and deputy general manager.

Read more

1. 1恒玄科技：超低功耗无线计算SoC领先供应商bestechnic.com
2. 2智能音频芯片 - 产品和应用 - 恒玄科技bestechnic.com
3. 3公司介绍 - 关于恒玄 - 恒玄科技bestechnic.com
4. 4BESTECHNIC - Wikidatawikidata.org
5. 5恒玄科技聘任李广平为董事会秘书nbd.com.cn