ChipMOS Technologies

ChipMOS Technologies is a Taiwanese semiconductor company engaged in semiconductor packaging and testing (OSAT). Founded in 1997, it describes itself as holding a leading position in the semiconductor packaging and testing field, serving semiconductor design companies, integrated device manufacturers and semiconductor wafer foundries. Its services include IC packaging (leadframe, substrate and flip-chip packaging), IC testing (wafer probe and testing for memory, mixed-signal and LCD driver IC products) and wafer bumping, which is mainly applied to LCD driver IC packaging. The company listed on the Taiwan Stock Exchange on 11 April 2014 under ticker 8150, and also has American Depositary Shares traded on the US Nasdaq market under ticker IMOS. It states it has more than 5,000 employees globally, with production plants located in the Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park.

ChipMOS Technologies was founded in 1997 and describes itself as holding a leading position in the semiconductor packaging and testing field. It listed on the Taiwan Stock Exchange on 11 April 2014 under ticker 8150, and also issued American Depositary Shares on the US Nasdaq market under ticker IMOS. In October 2016 it merged with its parent company, Bermuda ChipMOS Technologies, and in November of the same year issued American Depositary Receipts on the US Nasdaq market under ticker IMOS. The company states it has more than 5,000 employees globally, with production plants in the Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park; its Hsinchu Science Park plant focuses on testing services, its Southern Taiwan Science Park line focuses on packaging services, and its metal bumping and wafer testing lines are located at its own plant in Zhubei.

International leading OSAT service provider; a company with a leading position in the semiconductor packaging and testing field.

• IC packaging services

  A broad range of packaging solutions including leadframe packaging, substrate packaging and flip-chip packaging, to meet customers' customized service needs.

• IC testing services

  Professional wafer probe and testing services for memory, mixed-signal and LCD driver IC products.

• Wafer bumping services

  Wafer bumping mainly applied to LCD driver IC packaging, providing customers with an integrated upstream-to-downstream solution.

1. 1南茂科技股份有限公司- 半導體封裝測試服務、記憶體封裝、記憶體測試、LCD驅動IC測試、LCD驅動IC封裝、各類晶圓凸塊chipmos.com
2. 2南茂科技股份有限公司- 公司概況chipmos.com
3. 3南茂科技股份有限公司- 關於南茂chipmos.com
4. 4南茂科技股份有限公司- 關於南茂chipmos.com
5. 5ChipMOS Technologieswikidata.org