Finetech

Finetech is a German manufacturer of precision placement, assembly and rework equipment for the microelectronics and semiconductor industries. Founded in Berlin in 1992, shortly after German reunification, the company began as an apartment start-up built around a patented idea for precision-aligning two components. That idea became the FINEPLACER principle: a placement and assembly system with only one moving part and a fixed optical prism, which allowed very accurate assembly from a deliberately simple platform. Over the following decades Finetech grew into a global supplier of die bonding and SMD hot-gas rework systems. The company's product families span a wide range of accuracy and throughput requirements. The FINEPLACER line includes the lambda 2 sub-micron table-top die bonder, the sigma and femto 2 advanced sub-micron bonders, the pico 2 multi-purpose bonder, and the femto pro automatic multi-purpose bonder. For SMD rework, Finetech offers the FINEPLACER core plus and pico rs hot-air rework stations. More recently the company has introduced the FiNEXT P3 production platform, described as a next-generation die bonder for high-mix production, and has unveiled a beta prototype of a next-generation high-volume production die bonder supporting multiple bonding technologies and 12-inch wafers. Finetech positions itself around precision, in-house development and scalability. The company states that its entire product development and production chain is accomplished internally, including machine hardware, process modules, control electronics, tooling and software, which it says allows short response times and high effectiveness at every step. Its equipment supports sub-micron placement across an extensive range of bonding technologies, with quality optics and a highly stable machine design providing accuracy and repeatability. A recurring theme in its messaging is an "equipment migration pathway" that lets customers start with R&D-scale systems and transition processes into automated high-volume production. Finetech serves customers worldwide from multiple international locations and describes itself as a leading global supplier in its niche. Its customer base includes research institutes and semiconductor companies; testimonials on its website come from organizations such as Ferdinand-Braun-Institut, Ultra Communications Inc., AmTECH, TERASi and Silitronics. Applications cited include flip chip bonding, opto-electronic transceivers, sensor and opto-electronics assembly, and SiP modules for 5G/6G. The company is privately held and, according to its own communications, has grown organically without outside investors. Carlotta Baumann is identified as Managing Director, and press coverage has highlighted her role in advancing Finetech with a technological focus and organic growth. Finetech continues to invest in new process modules and platforms, including a plasma treatment module for the FINEPLACER femto platform and a Eurostars-funded project with Polar Light Technologies on sub-micron integration of dual-color microLED microdisplays.

Finetech's origins lie in Berlin in 1992, in the period following German reunification. According to the company's own account, it began as a modest apartment start-up. A Berlin engineer, working with a patented idea for precision-aligning two components with each other, built the first placement and assembly system based on what became known as the FINEPLACER principle. The design was notable for its simplicity: a system with only one moving part and a fixed optical prism, which was nevertheless capable of performing very accurate assembly. This combination of mechanical simplicity and high precision became the technical foundation on which the company built its product line. Over the following decades Finetech expanded from that start-up into a global supplier of placement, assembly and rework equipment for customers involved in microelectronics. Its equipment became known for high-accuracy bonding in micro assembly, supporting the most precise and complex applications, with sub-micron placement made possible across an extensive range of bonding technologies. Quality optics and a highly stable machine design were central to delivering the accuracy and repeatability demanded by advanced applications. Alongside its die bonding systems, the company developed professional SMD hot gas rework systems aimed at high-end rework of advanced devices. A distinctive element of Finetech's operating model is vertical integration. The company states that its entire product development and production chain is accomplished internally, covering machine hardware, process modules, control electronics, tooling, software and more. This approach, it says, allows for short response times and high effectiveness at every step. Another recurring strategic theme is the "equipment migration pathway": Finetech has focused on supporting customers at the development stage and helping them transition their processes into production, so that a system bought for research can evolve into part of a volume manufacturing flow. Finetech's product portfolio has grown to span multiple tiers of accuracy and throughput. The FINEPLACER family includes the lambda 2 sub-micron table-top die bonder, the sigma and femto 2 advanced sub-micron bonders, the pico 2 multi-purpose bonder and the femto pro automatic multi-purpose bonder. For rework, the company offers the FINEPLACER core plus and pico rs hot air SMD rework stations. More recently, Finetech introduced the FiNEXT P3 production platform, described as a next-generation die bonder for high-mix production, and unveiled a beta prototype of a next-generation high-volume production die bonder that supports multiple bonding technologies and 12-inch wafers. The company has continued to invest in process capability. It introduced a new Plasma Treatment Module for the FINEPLACER femto platform, using integrated atmospheric Argon plasma to enable in-situ surface preparation inside the die bonder for stable bonding and scalable advanced packaging. It also secured Eurostars funding for a project with Polar Light Technologies to advance the sub-micron integration of dual-color microLED devices into compact microdisplays, addressing a key bottleneck in next-generation display manufacturing. Finetech is privately held and, according to its own communications, has grown organically without investors. Carlotta Baumann serves as Managing Director; German business press has profiled her role in steadily advancing Finetech with a technological focus and organic growth, describing the company as a hidden champion of the semiconductor industry and a Berlin specialist in microsystems technology. The company reports serving customers in many countries from multiple international locations, with a customer base that includes research institutes and semiconductor firms such as Ferdinand-Braun-Institut, Ultra Communications Inc., AmTECH, TERASi and Silitronics.

• 2026

  Introduced a new Plasma Treatment Module for the FINEPLACER femto platform.

• 2026

  Secured Eurostars funding with Polar Light Technologies for sub-micron integration of dual-color microLED microdisplays.

• 1992

  Finetech founded in Berlin as an apartment start-up following German reunification; first placement and assembly system built on the patented FINEPLACER principle.

• Grew into a global supplier of placement, assembly and rework equipment for microelectronics.

• Introduced the FiNEXT P3 production platform, a next-generation die bonder for high-mix production.

• Unveiled beta prototype of next-generation high-volume production die bonder supporting multiple bonding technologies and 12-inch wafers.

Precision die bonding and SMD rework solutions that scale from first prototype to automated high-volume production, developed and manufactured in-house.

• FINEPLACER femto 2

  Advanced sub-micron bonder; cited by customers for enabling higher throughput automation of high-accuracy flip chip bonding.

• FINEPLACER femto pro

  Automatic multi-purpose bonder.

• FINEPLACER sigma

  Advanced sub-micron bonder used for applications from simple chip-to-submount to complex module assemblies with very high accuracy requirements.

• FINEPLACER pico 2

  Multi-purpose bonder with an easy learning curve.

• FINEPLACER lambda 2

  Sub-micron table-top die bonder.

• FINEPLACER core plus

  Hot air SMD rework station.

• FINEPLACER pico rs

  Hot air SMD rework station.

• FiNEXT P3

  Production platform; next-generation die bonder for high-mix production.

1. 1Home | Die Bonding Systems for R&D and Productionfinetech.de
2. 2Finetech | From Berlin Startup to Global Pioneer | Finetechfinetech.de
3. 3Products | Finetechfinetech.de
4. 4Latest news and press releases by Finetech | Finetechfinetech.de
5. 5Finetech GmbHwikidata.org