Hangzhou Silan Microelectronics
Corporate brand
UnclaimedA Chinese integrated device manufacturer that designs integrated circuits and produces semiconductor and microelectronics products.
Last updated October 9, 2026
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Overview
Hangzhou Silan Microelectronics, commonly known as Silan or Silan Microelectronics, is a Chinese semiconductor company headquartered in Hangzhou, Zhejiang. Its activities combine integrated-circuit design with semiconductor manufacturing, giving it an integrated device manufacturer orientation rather than limiting the business to fabless chip design. The company develops and manufactures semiconductor microelectronics products, including integrated circuits, power semiconductor devices, and LED chips. Its business is associated with China’s broader effort to build domestic capabilities across the semiconductor value chain. Silan was founded on 25 September 1997 by Chen Xiangdong and six other partners. Its creation followed the growing policy and entrepreneurial interest in China’s integrated-circuit sector during the late 1990s. The company was among the early private Chinese enterprises focused on IC manufacturing. It initially operated a five-inch wafer production line with monthly output of approximately 5,000 wafers or pieces, as described in the company’s historical accounts. After becoming publicly listed, Silan expanded its manufacturing base and began construction of a six-inch production line. A significant corporate milestone came on 11 March 2003, when Silan completed an initial public offering and was listed on the Shanghai Stock Exchange. It has been described as the first Chinese IC design company to go public. Access to the capital markets supported the expansion of its wafer-production capabilities and helped the company develop a more vertically integrated operating model. Silan faced serious financial pressure during the global financial crisis of 2008. Falling orders weakened sales while tighter bank lending requirements increased the burden of loan guarantees and constrained cash flow. Assistance from the Hangzhou municipal government enabled the company to repay the relevant loans within six months and continue operating. Following the crisis, Silan shifted its product emphasis away from more traditional consumer-electronics applications toward higher-value products, including areas better suited to an IDM model. The company continued to expand its manufacturing technology. In 2017, its eight-inch wafer fabrication facility began production, an event described in the reference material as the first production start of its kind in China. By 2020, the facility’s monthly production capacity had reached approximately 60,000 wafers or pieces. Silan also received more than one billion yuan in support from the China Integrated Circuit Industry Investment Fund, reflecting the strategic importance of domestic semiconductor capacity. In 2021, Silan launched a twelve-inch chip project. In February 2022, reporting indicated that the China Integrated Circuit Industry Investment Fund planned to invest 600 million yuan in that project. Later in 2022, Silan announced a plan to raise 6.5 billion yuan through a private placement to increase production of vehicle power semiconductors. The proposed expansion reflected rising domestic demand for power devices used in automotive and electrification applications. Silan’s current identity is therefore built around the combination of chip design, wafer fabrication, and semiconductor product manufacturing. Its principal strategic themes are domestic production capacity, process-node and wafer-size expansion, power semiconductor development, and movement into higher-value industrial and automotive applications. The available reference material does not provide a complete current product catalog, executive roster, official website, or detailed international sales breakdown.
History
Hangzhou Silan Microelectronics was established in Hangzhou on 25 September 1997 by Chen Xiangdong and six other partners. It emerged during an important period in the development of China’s private semiconductor sector and was one of the early privately founded Chinese companies involved in integrated-circuit manufacturing. The company began with a five-inch wafer production line whose reported monthly capacity was approximately 5,000 pieces. Silan reached a major financing and corporate-governance milestone on 11 March 2003, when it completed an initial public offering and became listed on the Shanghai Stock Exchange. It has been characterized as the first Chinese IC design company to achieve a public listing. Following the offering, the company began developing a six-inch wafer production line, using access to public capital to increase manufacturing scale and broaden its semiconductor capabilities. The 2008 global financial crisis placed Silan under considerable operating and financial pressure. Declining sales orders reduced demand for its products, while banks required additional loan guarantees, tightening the company’s cash position. Assistance from the Hangzhou municipal government helped Silan overcome the immediate liquidity problem and repay the loans within six months. After the crisis, management adjusted the product portfolio. The company moved away from reliance on conventional consumer-electronics products and toward higher-value semiconductor products more compatible with an integrated device manufacturer model. Silan subsequently invested in larger wafer manufacturing capacity and more advanced production platforms. Its eight-inch wafer fabrication facility began production in 2017. The facility was described in the available reference as the first eight-inch wafer fab in China to begin production. By 2020, its reported monthly capacity had reached 60,000 pieces. The company also received more than one billion yuan in funding support from the China Integrated Circuit Industry Investment Fund, linking its expansion to national and regional efforts to develop domestic semiconductor supply chains. The next expansion phase focused on twelve-inch manufacturing. Silan launched a twelve-inch chip project in 2021. In February 2022, reports said that the China Integrated Circuit Industry Investment Fund planned to invest 600 million yuan in the project. In October of the same year, Silan announced a proposed 6.5-billion-yuan private placement intended to expand production of vehicle power semiconductors. The plan reflected the increasing importance of automotive electronics, electric vehicles, and other domestic applications requiring high-volume power devices. Across its history, Silan has combined IC design with semiconductor production and the manufacture of related microelectronics products. Its product scope includes integrated circuits, power semiconductor devices, LED chips, and other semiconductor components. The company’s evolution from a small five-inch production operation into a listed IDM with eight-inch and planned twelve-inch capacity illustrates the broader development of China’s semiconductor manufacturing ecosystem. The available reference material does not establish a complete present-day executive roster, detailed overseas market footprint, official website, or comprehensive list of commercial product names.
- 2022
Investment plan reported for twelve-inch project
[1]A February report says the China Integrated Circuit Industry Investment Fund planned to invest 600 million yuan in Silan’s twelve-inch chip project.
- 2022
Private-placement plan targets vehicle power semiconductors
[1]In October, Silan announces a proposed 6.5-billion-yuan private placement to expand vehicle power semiconductor output.
- 2021
Twelve-inch chip project launched
[1]Silan launches a twelve-inch chip project as part of its continuing manufacturing expansion.
- 2020
Eight-inch capacity reaches approximately 60,000 pieces per month
[1]The company’s reported monthly production capacity reaches approximately 60,000 pieces, alongside more than one billion yuan in investment-fund support.
- 2017
Eight-inch wafer facility enters production
[1]Silan’s eight-inch wafer fab begins production, described by the reference as the first such fab to begin production in China.
- 2008
Recovery from financial-crisis pressures
[1]The company receives municipal support during a period of falling orders and restricted credit, repays the affected loans within six months, and later shifts toward higher-value IDM-oriented products.
- 2003
Initial public offering on the Shanghai Stock Exchange
[1]Silan completes its IPO on 11 March 2003 and becomes publicly listed, reportedly becoming the first Chinese IC design company to list publicly.
- 1997
Silan Microelectronics is founded
[1]Chen Xiangdong and six other partners establish Silan in Hangzhou on 25 September 1997. The company begins as an early privately founded Chinese IC manufacturing business.
Products and positioning
A Chinese integrated device manufacturer combining semiconductor design, wafer fabrication, and product manufacturing, with an emphasis on domestic capacity, power devices, LED chips, and higher-value industrial and automotive applications.
Integrated circuits
Integrated-circuit chips
Silan designs and manufactures integrated-circuit products as part of its combined design-and-manufacturing business. ICs form the core of the company’s original semiconductor identity and remain part of its broader portfolio of microelectronics products. The available reference does not specify individual commercial families or model numbers.
Power semiconductors
Power semiconductor devices
Power devices are a major strategic area for Silan, particularly as the company has shifted toward higher-value applications beyond traditional consumer electronics. Its later capacity-expansion plans specifically targeted vehicle power semiconductors, indicating intended use in automotive and electrification-related systems. Specific device technologies and product names are not identified in the supplied reference.
Optoelectronic semiconductors
LED chips
LED chips are included among Silan’s semiconductor product categories. They represent the company’s participation in optoelectronic semiconductor manufacturing alongside ICs and power devices. The available material does not provide detailed specifications, application sectors, or named product series.
Automotive semiconductors · 2022
Vehicle power semiconductor products
Silan’s 2022 private-placement proposal was directed partly toward increasing production of power semiconductors for vehicles. The initiative reflects a strategic focus on automotive demand and the growing semiconductor content of electrified transportation. The reference does not identify particular vehicle-device families or confirm the final implementation of the proposed financing.
Brand decisions
2022
Proposed capital raising for vehicle power semiconductor capacityStrategyBackground
Silan identified increasing domestic demand for vehicle power semiconductors and sought additional capital to expand output.
Action taken
In October 2022, the company announced a proposed 6.5-billion-yuan private placement to support expansion.
Aftermath
The available reference does not establish whether the proposed financing was completed or the final scale of the resulting capacity.
Proposed private-placement amount. 6.5 billion yuan proposed (October 2022 announcement)
2021
Launch of twelve-inch chip projectGeneration changeBackground
Following the expansion of its eight-inch production platform, Silan pursued a larger-wafer manufacturing project.
Action taken
Silan launched a twelve-inch chip project and subsequently sought investment support for it.
Aftermath
A planned 600-million-yuan investment from the China Integrated Circuit Industry Investment Fund was reported in February 2022.
2017
Expansion to eight-inch wafer manufacturingGeneration changeBackground
Silan sought to increase manufacturing scale and strengthen its integrated device manufacturing capabilities.
Action taken
The company brought an eight-inch wafer fabrication facility into production.
Aftermath
By 2020, reported monthly capacity had grown to approximately 60,000 pieces.
2008
Shift toward higher-value IDM products after the financial crisisStrategyBackground
The 2008 financial crisis reduced orders and tightened Silan’s cash flow. After receiving support that enabled it to repay loans, the company reassessed its product portfolio.
Action taken
Silan moved away from a stronger reliance on traditional consumer-electronics products and placed greater emphasis on higher-end products suited to an integrated device manufacturer model.
Aftermath
The shift established a strategic foundation for later expansion in wafer fabrication and higher-value semiconductor applications.
Recent events
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