Hwatsing Technology Co., Ltd.
Corporate brand
UnclaimedChinese high-end semiconductor equipment maker and STAR Market-listed platform supplier of CMP, ion implantation, thinning, edge polishing, dicing and wet-process tools plus wafer reclaim services.
Last updated September 26, 2026
AI crawler reads
No AI crawler has read this profile yet.
Overview
Hwatsing Technology Co., Ltd. (华海清科股份有限公司), trading under the Hwatsing brand, is a Chinese manufacturer of high-end semiconductor process equipment headquartered in Jinnan District, Tianjin. The company was established on 10 April 2013 as Tianjin Hwatsing Electromechanical Technology Co., Ltd. and has grown into one of China's leading suppliers of chemical mechanical polishing (CMP) systems, a critical step in integrated circuit manufacturing used to planarize wafer surfaces at the nanometre scale. Hwatsing's core product line is built around its Universal series of 12-inch (300 mm) CMP tools, including the Universal-300, Universal-300 Plus, Universal-300 Dual, Universal-300 X, Universal-300 T, Universal-300 FS, Universal-300 E, Universal-300 B, Universal-S300 and Universal-H300. These tools are deployed in integrated circuits, advanced packaging, large silicon wafers, third-generation semiconductors, MEMS and Micro LED manufacturing. Beyond CMP, the company has expanded into ion implantation equipment, wafer thinning and panel thinning tools, edge polishing, dicing, wet-process equipment, wafer reclaim, and key consumables and maintenance services, pursuing a platform strategy it describes as "equipment plus services." The company reached several commercial milestones in the 2020s: its CMP tools passed one million wafers processed at a customer's mass-production line in September 2019; the 100th 12-inch CMP tool shipped in June 2021; and in June 2022 Hwatsing listed on the Shanghai Stock Exchange STAR Market under ticker 688120. It has since added a new-generation 12-inch ultra-precision wafer thinning machine, a single-wafer cleaning tool, a 12-inch thinning-and-film-lamination integrated tool, a 12-inch wafer dicing tool, a 12-inch edge polishing tool and a 12-inch low-temperature ion implanter (iPUMA-LT). In 2024 it received a National Technology Invention First Prize as part of the National Science and Technology Awards. Hwatsing operates a nationwide footprint with five subsidiaries, five branches and more than 30 service centres, and in 2025 opened a Beijing plant and began a wafer reclaim capacity expansion in Kunshan, Jiangsu, targeting 600,000 wafers per month of reclaim capacity. Its stated vision is to become a Tier 1 international semiconductor equipment supplier.
History
Hwatsing was founded on 10 April 2013 as Tianjin Hwatsing Electromechanical Technology Co., Ltd. (天津华海清科机电科技有限公司). The company set out to develop domestic Chinese chemical mechanical polishing (CMP) equipment, a semiconductor manufacturing step previously dominated by foreign suppliers. In March 2014 it completed development of the first domestically produced 12-inch CMP commercial model, the Universal-300. In November 2015 Hwatsing took on a role in China's "National 02 Science and Technology Major Project," a state programme supporting development of core semiconductor manufacturing equipment and materials. In 2017 the Universal-300 Plus entered customer use, and subsequent models — Universal-300 Dual, Universal-300 X and Universal-300 T — were introduced to the market and achieved volume sales. The company reported that its CMP equipment market share and import-substitution rate ranked among the leading domestic IC equipment makers. Commercial traction accelerated toward the end of the decade. In September 2019, Hwatsing's CMP equipment passed one million wafers processed on a customer's mass-production line. In June 2021 the company shipped its 100th 12-inch CMP tool, and in July 2021 its grinding and polishing equipment industrial base began operation. In September 2021 its first 12-inch ultra-precision wafer thinning machine entered customer validation, and in November 2021 Hwatsing was named a national "Manufacturing Single Champion Demonstration Enterprise." By December 2021 the company had manufactured more than 100 machines in a single year. In January 2022 Hwatsing's CMP equipment entered an international leading customer in the packaging field. In February 2022 its wafer reclaim products reached volume production with cumulative shipments exceeding 100,000 wafers. On 8 June 2022 the company listed on the Shanghai Stock Exchange STAR Market under stock code 688120. Expansion continued after listing. In May 2023 a new-generation 12-inch ultra-precision wafer thinning machine shipped, and in September 2023 the first single-wafer cleaning machine entered customer use. On 24 June 2024 Hwatsing received a National Technology Invention First Prize in the 2023 National Science and Technology Awards. During 2024 the first 12-inch thinning-and-film-lamination integrated tool entered customer use, and the first 12-inch wafer dicing tool and 12-inch wafer edge polishing tool shipped. In 2025 the company opened its Beijing plant on 25 January. On 27 June 2025 it began a wafer reclaim capacity expansion project in Kunshan, Jiangsu, which upon completion is expected to bring total wafer reclaim capacity to 600,000 wafers per month. On 30 June 2025 its 12-inch thinning-and-film-lamination integrated tool, Versatile-GM300, was shipped in volume to a leading domestic semiconductor enterprise, and on 14 July 2025 its first 12-inch low-temperature ion implanter, iPUMA-LT, shipped. Across this period Hwatsing built a nationwide footprint of five subsidiaries, five branches and more than 30 service centres, positioning itself as an international supplier of high-end IC equipment and technical services.
- 2025
Hwatsing Beijing plant officially opened.
- 2025
Wafer reclaim capacity expansion project launched in Kunshan, Jiangsu; total reclaim capacity targeted at 600,000 wafers per month.
- 2025
12-inch thinning-and-film-lamination integrated tool Versatile-GM300 shipped in volume to a leading domestic semiconductor enterprise.
- 2025
First 12-inch low-temperature ion implanter, iPUMA-LT, shipped.
- 2024
Awarded National Technology Invention First Prize in the 2023 National Science and Technology Awards.
- 2024
First 12-inch thinning-and-film-lamination integrated tool enters customer use; first 12-inch wafer dicing tool and 12-inch wafer edge polishing tool ship.
- 2023
New-generation 12-inch ultra-precision wafer thinning machine shipped.
- 2023
First single-wafer cleaning machine enters customer use.
- 2022
CMP equipment enters an international leading customer in the packaging field.
- 2022
Wafer reclaim products reach volume production; cumulative shipments exceed 100,000 wafers.
Products and positioning
High-end semiconductor equipment manufacturer pursuing an "equipment plus services" platform strategy, aiming to be a Tier 1 international semiconductor equipment supplier.
Universal-S300
12-inch CMP equipment combining advanced polishing process, high efficiency and high stability; uses a stacked layout for high throughput in limited floor space, with modular design for different process requirements.
Universal-H300
12-inch CMP equipment with an innovative polishing system architecture for significantly improved polishing efficiency and advanced cleaning technology.
Universal-300 FS
12-inch CMP equipment with diverse advanced cleaning technologies, superior polishing units and multiple endpoint detection technologies, targeting advanced logic processes.
Universal-300 T
Leading 12-inch CMP equipment based on Hwatsing's proprietary technologies, with superior polishing units, multiple endpoint detection technologies and advanced combined cleaning technology.
Universal-300 X
Advanced 12-inch CMP equipment for high-end market demand, with superior polishing and cleaning units and multiple advanced endpoint detection technologies.
Universal-300 Dual
Mature 12-inch CMP equipment with multiple polishing and cleaning units and multiple advanced endpoint detection technologies, targeting mature process nodes.
Universal-300 E
Mature 12-inch CMP equipment for mid-to-high-end market demand, with superior polishing and cleaning units and multiple advanced endpoint detection technologies.
Universal-300 B
12-inch CMP equipment compatible with 4/6/8/12-inch wafers and multiple materials, with small footprint and high cost-performance.
Versatile-GM300
12-inch thinning-and-film-lamination integrated tool; shipped in volume to a leading domestic semiconductor enterprise in June 2025.
iPUMA-LT
12-inch low-temperature ion implanter; first unit shipped in July 2025.
Sources4 sources
Cite this profile: Cite the canonical profile. /brand-wiki/hwatsing · Editorial policy · How profiles are compiled