LinkStar Microtronics
Singapore-based silicon photonics enterprise founded in 2010, supplying photonic integrated circuits for AI and hyperscale data center networking.
Last updated September 28, 2026
AI crawler reads
2requests
1companies- Anthropic2
- Profile
- 2
- Controversies
- 0
- JSON · MD
- 0
- First read
- Nov 4, 2026
- Latest read
- Nov 4, 2026
From this site's server log
Overview
LinkStar Microtronics is a Singapore-based silicon photonics technology enterprise established in 2010 by globally recognized experts with over twenty years of industry experience. Originally a spin-off from the Institute of Microelectronics (IME) at A*STAR in 2010, the company has maintained long-standing research and development collaborations with the Institute across multiple technological generations. It has achieved high-volume shipments of silicon V-groove and PLC products over the years. Since 2021, LinkStar has intensified its focus on the development of silicon photonic transceiver technologies and products designed for data center and AI interconnect applications. Leveraging advanced technology and a premier global supply chain, LinkStar currently provides a comprehensive portfolio for AI and hyperscale data center networking markets, including 400G, 800G, and 1.6T photonic integrated circuits (PICs), as well as customized 1.6T/3.2T PICs for NPO/CPO applications. Its product line includes microring modulator transmitter PICs operating at speeds from 100G to 12.8T, as well as DR4, DR8, and DR16 transmitter PICs for fully retimed (DSP) and LPO applications. The company is headquartered at 3 Ang Mo Kio Street 62, #05/15-16, Link@AMK, Singapore 569139. LinkStar positions itself as a provider of highly integrated photonics connectivity solutions for AI and hyperscale data center networking, with a focus on co-packaged optics (CPO), linear pluggable optics (LPO), and near-packaged optics (NPO). Its technology portfolio includes photonic engines with wire-bond and flip-chip co-packaged optics in 2.5D/3D configurations with face-up and face-down options. The company's PICs support up to 12.8T with 400Gbps/lane MZI and MRR modulators.
History
LinkStar Microtronics was established in 2010 by globally recognized experts with over twenty years of industry experience. Originally a spin-off from the Institute of Microelectronics (IME) at A*STAR in 2010, the company has maintained long-standing research and development collaborations with the Institute across multiple technological generations. In its early years, LinkStar achieved high-volume shipments of silicon V-groove and PLC products, building a foundation in silicon photonics manufacturing and supply. Since 2021, the company has intensified its focus on the development of silicon photonic transceiver technologies and products designed for data center and AI interconnect applications. This strategic shift aligned with the rapid growth of AI and hyperscale data center networking demands. Leveraging advanced technology and a premier global supply chain, LinkStar currently provides a comprehensive portfolio for AI and hyperscale data center networking markets, including 400G, 800G, and 1.6T PICs, as well as customized 1.6T/3.2T PICs for NPO/CPO applications. The company is headquartered in Singapore at 3 Ang Mo Kio Street 62, #05/15-16, Link@AMK, Singapore 569139. It continues to develop highly integrated photonics connectivity solutions, including photonic engines with wire-bond and flip-chip co-packaged optics in 2.5D/3D configurations with face-up and face-down options, and PICs supporting up to 12.8T with 400Gbps/lane MZI and MRR modulators.
- 2021
Company intensified focus on silicon photonic transceiver technologies for data center and AI interconnect applications.
- 2010
LinkStar Microtronics established as a spin-off from the Institute of Microelectronics (IME) at A*STAR.
Products and positioning
Provider of highly integrated photonics connectivity solutions for AI and hyperscale data center networking markets, with a focus on co-packaged optics (CPO), linear pluggable optics (LPO), and near-packaged optics (NPO).
12.8T Microring Modulator Transmitter PIC
Microring modulators PIC operating at 12.8Tbps for CIO and CPO.
6.4T Microring Modulator Transmitter PIC
Microring modulators PIC operating at 6.4Tbps for CIO and CPO.
3.2T Microring Modulator Transmitter PIC
Microring modulators PIC operating at 3.2Tbps for CIO and CPO.
400G Microring Modulator Transmitter PIC
Microring modulators PIC operating at 448Gbps.
200G Microring Modulator Transmitter PIC
Microring modulators PIC operating at 224Gbps.
100G Microring Modulator Transmitter PIC
Microring modulators PIC operating at 112Gbps.
NRZ 100G Microring Modulator Transmitter PIC
Microring modulators PIC operating at 128Gbps NRZ.
NRZ 50G Microring Modulator Transmitter PIC
Microring modulators PIC operating at 64Gbps NRZ.
6.4T 2×DR8 Transmitter PIC
16 transmit lanes operating at 400Gbps/lane with mirror layout.
3.2T DR16 Transceiver PIC
16 transmit lanes operating at 200Gbps/lane for NPO/CPO.
400G DR4 Tx PIC
A 400Gbps PIC supporting 4 transmit lanes operating at 100Gbps per lane; fully retimed (DSP) and LPO applications.
Sources4 sources
- 1Linkstar Microtronics / Leading Silicon Photonics Integrated Chip Manufacturerlinkstarmicrotronics.com
- 2About | Linkstar Microtronics / Leading Silicon Photonics Integrated Chip Manufacturerlinkstarmicrotronics.com
- 3Product Archive | Linkstar Microtronicslinkstarmicrotronics.com
- 4LinkStar Microtronicswikidata.org
Cite this profile: Cite the canonical profile. /brand-wiki/linkstar-microtronics · Editorial policy · How profiles are compiled