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Renesas Electronics

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A Japanese semiconductor company supplying embedded processors, analog, power, connectivity and development-software solutions.

Last updated November 4, 2026

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Overview

Renesas Electronics Corporation is a Japanese semiconductor manufacturer headquartered in Tokyo. Its products include microcontrollers, microprocessors, automotive systems-on-chip, analog and mixed-signal devices, power-management components, connectivity products and software used to design and develop embedded systems. The company primarily serves automotive, industrial, infrastructure and Internet-of-Things applications, where long product lifecycles, functional safety, low power consumption, real-time performance and supply continuity are important. The modern Renesas organization began operations on April 1, 2010, when NEC Electronics merged with Renesas Technology. NEC Electronics was the surviving legal entity and adopted the Renesas Electronics name. Renesas Technology itself had been created in 2003 by combining the non-DRAM semiconductor businesses of Hitachi and Mitsubishi Electric. The brand name is derived from the expression “Renaissance Semiconductor for Advanced Solutions.” This lineage gave Renesas a broad collection of Japanese semiconductor technologies, including the 78K, V850, R8C, M16C, H8, RX and SuperH architectures. During its early years, Renesas faced severe operational, financial and manufacturing challenges. The 2011 Tōhoku earthquake and tsunami and flooding in Thailand disrupted factories and supply chains, while the company also carried a large and complex manufacturing footprint and overlapping product families. A restructuring supported by Japan’s state-backed Innovation Network Corporation of Japan helped stabilize the business. Renesas reduced its workforce, consolidated or sold facilities, and moved toward a more flexible fab-light manufacturing model that combines internal production with external foundries and outsourced assembly and testing. From the middle of the 2010s, acquisitions became central to Renesas’s strategy. Intersil expanded its analog and power portfolio; Integrated Device Technology broadened the company’s analog, mixed-signal, timing and data-center capabilities; Dialog Semiconductor added power-management, connectivity and low-power technologies; and Transphorm strengthened the company’s gallium-nitride power position. The 2024 acquisition of Altium added electronic-design software and supported Renesas’s effort to connect semiconductor products with system-development workflows. Other purchases, including Celeno Communications, Reality AI, Steradian Semiconductors and Panthronics, added wireless, edge-intelligence, radar and near-field-communication capabilities. Renesas’s principal MCU franchises include the low-power 16-bit RL78 family, the 32-bit RX family, the Arm Cortex-M-based RA family and the automotive RH850 family. Its R-Car automotive SoCs target advanced driver assistance, automated driving, digital cockpits, infotainment and vehicle gateways. The RZ processor family supports industrial human-machine interfaces, embedded vision, real-time control and industrial networking. Alongside these processors, the company sells analog, power, timing, connectivity and security products and provides software, development tools and reference designs. The company remains particularly important in automotive and industrial electronics. Its automotive portfolio combines real-time MCUs, high-performance SoCs, power devices, analog products and connectivity components so that customers can develop complete vehicle and industrial subsystems. In 2025, Renesas was described as the world’s third-largest MCU supplier and ranked fifth in automotive semiconductors by sales in 2024, with a reported 7% global share in that market. These rankings are market measurements rather than ownership or financial claims by the company itself. Renesas continues to adjust its technology and capital strategy. In 2025 it discontinued development of its own silicon-carbide power semiconductors and identified gallium nitride as a more concentrated investment area. The company also announced a…

History

Renesas’s corporate ancestry reaches back to semiconductor operations developed by Hitachi, Mitsubishi Electric and NEC. NEC separated its semiconductor activities into NEC Electronics on November 1, 2002, and the company was subsequently listed in Tokyo. In April 2003, Hitachi and Mitsubishi Electric combined their non-DRAM semiconductor operations to form Renesas Technology, owned 55% by Hitachi and 45% by Mitsubishi Electric. Their DRAM activities had been separated into Elpida Memory rather than included in Renesas Technology. In September 2009, NEC Electronics and Renesas Technology agreed to merge. The transaction took effect on April 1, 2010. NEC Electronics remained the legal survivor, changed its name to Renesas Electronics Corporation and began operating under the Renesas brand. The merger brought together multiple MCU and embedded-processor traditions, including NEC’s 78K and V850 families and Renesas Technology’s R8C, M16C, H8, RX and SuperH lines. The RL78 family subsequently combined elements of the NEC-originated 78K0R architecture with peripheral technologies from the 78K and Renesas R8C families. The new company struggled with excess manufacturing capacity, overlapping products and weak financial performance. The 2011 earthquake and tsunami in northeastern Japan and floods in Thailand caused substantial production and supply-chain disruption. Renesas responded with restructuring, workforce reductions and the sale or consolidation of facilities. In September 2013, a government-backed capital injection and third-party share allotment made the Innovation Network Corporation of Japan the company’s largest shareholder, with a 69.15% stake. The restructuring improved operating performance: for the year ended March 2014, Renesas reported operating income of ¥67.6 billion, compared with an operating loss of ¥23.2 billion in the prior year, while its net loss narrowed substantially. Renesas briefly pursued mobile semiconductors through Renesas Mobile, created in 2010 by combining its mobile business with wireless-modem assets acquired from Nokia. It later exited that area, transferring LTE assets to Broadcom in 2013 and absorbing Renesas Mobile in 2014. The company then concentrated more strongly on automotive, industrial and embedded applications. Beginning in 2017, acquisitions expanded Renesas beyond its traditional MCU base. Intersil added analog and power-management products. The 2019 acquisition of Integrated Device Technology, valued at approximately $6.7 billion, added analog, mixed-signal, timing, memory-interface and other technologies. Hidetoshi Shibata, previously the company’s chief financial officer, became president and CEO on July 1, 2019. Dialog Semiconductor was acquired in 2021 for approximately $6 billion, broadening Renesas’s power-management, connectivity and low-power semiconductor capabilities. Further acquisitions included Celeno Communications, Reality AI and Steradian Semiconductors. A fire at the Naka Factory in March 2021 temporarily interrupted production during the global automotive-chip shortage. Production resumed in stages from April. Renesas continued to broaden its portfolio through the acquisitions of Panthronics, Transphorm and Altium. The Altium transaction, announced in 2024 for approximately $5.9 billion, expanded the company into electronic-design software and later supported the Renesas 365 development platform. INCJ gradually reduced its ownership beginning in 2017 and sold its remaining Renesas shares in November 2023. The company also completed an approximately ¥200 billion share repurchase in June 2022. Renesas was added to the Nikkei 225 index in April 2023 and received the Global Semiconductor Alliance’s Outstanding Asia-Pacific Semiconductor Company Award in December 2022. In 2025, weaker demand led Renesas to announce a workforce reduction and defer salary increases. The company also changed its power-semiconductor priorities, ending development of its own SiC devices and emphasizing GaN. Renesas had entered a ten-year SiC wafer arrangement with Wolfspeed in 2023 and provided a $2 billion deposit. Wolfspeed’s 2025 Chapter 11 restructuring resulted in Renesas converting the deposit into other financial assets and recognizing a ¥236.6 billion loss related to the exposure. Renesas reported a ¥51.8 billion loss attributable to owners of the parent for 2025. In February 2026, Renesas agreed to transfer its IDT-originated timing business to SiTime for cash and shares. The transaction was completed on July 1, 2026. Renesas also pursued potential technical cooperation involving SiTime’s MEMS resonators and Renesas microcontrollers and SoCs. In parallel, its sustainability strategy set a 2040 carbon-neutrality target and a validated goal to reduce Scope 1 and Scope 2 emissions by 38% from 2021 levels by 2030.

  • 2026

    Timing business transferred to SiTime

    [1]

    Renesas completed the transfer of its timing business to SiTime.

  • 2025

    SiC strategy changes

    [1]

    Renesas ended development of its own SiC power semiconductors and emphasized GaN investment.

  • 2024

    Altium acquisition

    [1]

    Renesas expanded into electronic-design software through its acquisition of Altium.

  • 2023

    INCJ exits Renesas

    [1]

    INCJ sold its remaining Renesas shares, ending its ownership of the company.

  • 2022

    Share repurchase completed

    [1]

    Renesas completed an approximately ¥200 billion repurchase of its own shares.

  • 2021

    Dialog Semiconductor acquisition

    [1]

    Renesas acquired Dialog Semiconductor, expanding its power-management and connectivity portfolio.

  • 2019

    IDT acquisition and CEO transition

    [1]

    Renesas acquired IDT and Hidetoshi Shibata became president and CEO.

  • 2017

    Intersil acquisition

    [1]

    Renesas completed the acquisition of U.S. analog semiconductor company Intersil.

  • 2013

    INCJ becomes controlling shareholder

    [1]

    A third-party share allotment gave the state-backed Innovation Network Corporation of Japan a 69.15% stake.

  • 2010

    Renesas Electronics begins operations

    [1]

    NEC Electronics absorbed Renesas Technology and adopted the Renesas Electronics name.

Products and positioning

A broad embedded-semiconductor and system-development provider focused on automotive, industrial, infrastructure and IoT applications.

  • 16-bit microcontrollers · 2010

    RL78

    The RL78 family is a low-power 16-bit MCU platform introduced after the 2010 merger. It combines the NEC-originated 78K0R CPU core with peripheral technologies associated with the 78K and Renesas R8C families. Its variants support different instruction and processing capabilities, while features such as snooze mode allow selected peripherals to operate while the CPU is stopped.

  • 32-bit microcontrollers · 2009

    RX

    The RX family is a 32-bit MCU platform originally developed by Renesas Technology. The initial RX600 series targeted metering, motor control, human-machine interfaces, networking and industrial automation. Later RX families expanded toward lower-power and higher-performance applications.

  • Arm Cortex-M microcontrollers

    RA

    RA microcontrollers use Arm Cortex-M processor cores and are designed for embedded applications requiring a balance of performance, security, low power and software portability. Renesas supports the family with its Flexible Software Package and associated development tools.

  • automotive microcontrollers

    RH850

    RH850 is Renesas’s automotive MCU family for real-time vehicle-control systems such as powertrain, chassis and body electronics. Devices emphasize functional safety, reliability and security, with later versions adding multicore processing, motor control, automotive communications and safety features.

  • automotive systems-on-chip

    R-Car

    R-Car SoCs target advanced driver assistance, automated driving, infotainment, digital cockpits and vehicle gateways. The fifth-generation R-Car X5H, introduced in 2024, uses a 3 nm process and is intended to consolidate processing across several automotive domains.

  • embedded microprocessors

    RZ

    The RZ family comprises 32-bit and 64-bit processors for industrial and infrastructure applications. Subfamilies address high-resolution interfaces, embedded vision, real-time control, industrial Ethernet and networking, including RZ/A, RZ/G, RZ/T and RZ/N.

  • electronic-design software · 2026

    Renesas 365

    Renesas 365 is a digital development platform built around technology obtained through the Altium acquisition. It is intended to connect electronic-design workflows with Renesas semiconductor products, software and system-development resources.

Brand decisions

  • 2026

    Transfer timing business to SiTimeM&A

    Background

    The timing business originated in Renesas’s acquisition of IDT and was no longer central to the company’s desired portfolio structure.

    Action taken

    Renesas transferred the timing business to SiTime for approximately $1.5 billion in cash and about 4.13 million SiTime shares.

    Aftermath

    The transaction was completed on July 1, 2026, with the companies also exploring integration of SiTime MEMS resonators with Renesas processors.

    Consideration. Approximately $1.5 billion cash plus approximately 4.13 million SiTime shares (2026)

  • 2025

    Reprioritize power-semiconductor investmentStrategy

    Background

    Renesas reassessed its power-semiconductor roadmap amid market weakness and financial exposure to Wolfspeed.

    Action taken

    The company discontinued development of its own SiC power semiconductors and concentrated more investment on GaN.

    Aftermath

    Renesas recorded a ¥236.6 billion loss connected with its Wolfspeed exposure and continued repositioning its power portfolio.

    Loss related to Wolfspeed exposure. ¥236.6 billion (2025 financial statements)

  • 2024

    Acquire AltiumM&A

    Background

    Renesas aimed to extend its semiconductor business into electronic-design and system-development software.

    Action taken

    Renesas acquired Altium for approximately $5.9 billion.

    Aftermath

    Altium technology became part of the company’s broader digital-development strategy and Renesas 365 platform.

    Transaction value. Approximately $5.9 billion (2024)

  • 2021

    Acquire Dialog SemiconductorM&A

    Background

    Renesas wanted to expand in power management, connectivity and low-power semiconductor technologies.

    Action taken

    Renesas acquired Dialog Semiconductor for approximately $6 billion.

    Aftermath

    Dialog broadened Renesas’s portfolio and customer reach in mobile, industrial, automotive and IoT applications.

    Transaction value. Approximately $6 billion (2021)

  • 2019

    Acquire Integrated Device TechnologyM&A

    Background

    Renesas pursued a larger analog and mixed-signal portfolio and additional data-center and timing capabilities.

    Action taken

    Renesas acquired IDT in a transaction valued at approximately $6.7 billion.

    Aftermath

    IDT technologies expanded Renesas’s analog, timing and interface businesses; the timing operation was later transferred to SiTime.

    Transaction value. Approximately $6.7 billion (2019)

  • 2017

    Acquire IntersilM&A

    Background

    Renesas sought to reduce dependence on microcontrollers and strengthen analog and power-management offerings.

    Action taken

    The company acquired Intersil and integrated its analog semiconductor technologies.

    Aftermath

    The acquisition broadened Renesas’s product range for industrial, infrastructure and automotive customers.

  • 2013

    Accept state-backed recapitalizationStrategy

    Background

    Operational disruption, overlapping businesses and financial losses created a need for recapitalization and restructuring.

    Action taken

    Renesas issued shares through a third-party allotment that gave INCJ a 69.15% ownership position.

    Aftermath

    The company reduced its manufacturing footprint and improved operating performance before INCJ gradually sold its stake.

    Operating income. Operating loss of ¥23.2 billion → Operating income of ¥67.6 billion (Fiscal year ended March 2014 compared with the prior year)

  • 2010

    Merge NEC Electronics with Renesas TechnologyM&A

    Background

    The merger was intended to combine the semiconductor operations inherited from NEC, Hitachi and Mitsubishi Electric.

    Action taken

    NEC Electronics absorbed Renesas Technology and changed its name to Renesas Electronics Corporation.

    Aftermath

    The combined company inherited a broad portfolio of MCU architectures and manufacturing sites but subsequently faced major restructuring pressures.

Recent events

  • Reported

    Renesas launches industry-first 100V E-mode low-voltage GaN FET series for AI data centers and robotics[3]

    Renesas Electronics announced on 2026-10-08 that it is expanding its GaN product portfolio into low-voltage applications, introducing an industry-first series of 100V enhancement-mode (E-mode) GaN discrete power transistors (RTP100E005G1FL, RTP100E2P6G1FL, RTP100E1P8G1FL-DSC, RTP100E1P2G1FL-DSC) targeting high-power-density applications such as AI data centers, humanoid robots, factory automation and industrial motor drives, power tools, and solar micro-inverters.

  • Reported

    Renesas announces automotive wireless-charging reference design[4]

    Renesas announced the P9261-3C-CRBv2, a next-generation customer reference design for in-vehicle wireless charging that is certified to WPC Qi 1.3.

  • Reported

    Renesas completes acquisition of Celeno[5]

    Renesas completed its acquisition of Celeno Communications on December 20, 2021, for approximately US$315 million. Celeno became a wholly owned subsidiary of Renesas.

  • Reported

    Renesas introduces industrial-temperature DDR5 and DDR4 clock drivers[6]

    Renesas introduced industrial-temperature DDR5 and DDR4 registered clock drivers, which the company said were available now.

  • Reported

    Renesas announces agreement to acquire Celeno[7]

    Renesas announced a definitive agreement to acquire Celeno in an all-cash transaction valuing Celeno at approximately US$315 million, subject to customary closing conditions. The acquisition was expected to close by the end of calendar year 2021.

  • Reported

    Renesas completes acquisition of Dialog Semiconductor[8]

    Renesas announced completion of its acquisition of all issued and to be issued share capital of Dialog Semiconductor. Dialog became a wholly owned subsidiary of Renesas.

  • Reported

    Renesas Electronics completes acquisition of Dialog[9]

    Renesas Electronics announced that it had completed its acquisition of Dialog.

  • Reported

    Renesas announces succession in automotive solutions leadership[9]

    Renesas announced that Vivek Bhan would succeed Tomomitsu Mauka as senior vice president and deputy general manager of the automotive solutions business, effective October 1, 2021.

  • Reported

    Renesas launches radiation-hardened plastic device portfolio for satellites[10]

    Renesas launched a new line of plastic-packaged radiation-hardened devices for satellite power management systems, including four devices for medium and geosynchronous Earth orbit missions and small satellites.

  • Unconfirmed

    Reported

    Renesas and Digilent develop a new Pmod interface[11]

    Renesas and Digilent worked together to develop a Type 6A expansion I2C Pmod interface as part of the Quick-Connect IoT system.

Read more(42)

Sources73 sources

  1. 1Renesas Electronicsen.wikipedia.org
  2. 2Renesas Electronics official websiterenesas.com
  3. 3瑞萨电子业界率先推出面向AI数据中心和机器人应用的100V增强型低压GaN FET系列finance.sina.com.cn
  4. 4瑞萨电子发布车载无线充电参考设计finance.sina.com.cn
  5. 5瑞萨电子完成对Celeno的收购iconnect007.com
  6. 6瑞萨推出工业温度级 DDR5 和 DDR4 时钟驱动器eejournal.com
  7. 7Renesas宣布达成收购Celeno的协议iconnect007.com
  8. 8瑞萨电子完成对Dialog Semiconductor的收购finanznachrichten.de
  9. 9瑞萨电子完成收购 Dialogfinance.sina.com.cn
  10. 10Renesas推出面向卫星的抗辐射塑封器件产品组合eejournal.com
  11. 11瑞萨电子与Digilent合作开发新型Pmod接口finance.sina.com.cn
  12. 12瑞萨电子推出RZ/V2L MPUfinance.sina.com.cn
  13. 13瑞萨RX65N获得CMVP 3级认证finance.sina.com.cn
  14. 14瑞萨工厂火灾后临时停产12寸生产线auto.sina.com.cn
  15. 15瑞萨更新 R-Car V3H SoCeejournal.com
  16. 16瑞萨同意收购Dialog Semiconductorsiliconangle.com
  17. 17瑞萨与戴乐格披露收购协商finance.sina.com.cn
  18. 18芯片制造商提高半导体价格finance.sina.com.cn
  19. 19瑞萨推出云端实验室eejournal.com
  20. 20瑞萨与微软宣布合作推进网联汽车开发eejournal.com
  21. 21LeddarTech与Renesas扩大汽车ADAS平台合作finanznachrichten.de
  22. 22瑞萨电子推出IP Utilitiesfinance.sina.com.cn
  23. 23瑞萨电子推出九款RA6M4 MCU产品finance.sina.com.cn
  24. 24瑞萨I3C及SPD集线器产品通过ASPEED认证finance.sina.com.cn
  25. 25瑞萨电子宣布推出EtherCAT功能安全软件套件cieonline.co.uk
  26. 26瑞萨电子推出DDR5数据缓冲器eejournal.com
  27. 27瑞萨电子、贝特莱与中印云端签署战略合作协议tech.sina.com.cn
  28. 28瑞萨电子宣布RYZ012蓝牙模块样品开放订购eejournal.com
  29. 29美光宣布DDR5技术应用支援计划chinatimes.com
  30. 30RS Components推出瑞萨RX23E-A微控制器eejournal.com
  31. 31瑞萨电子推出四款I3C Basic总线扩展产品tech.sina.com.cn
  32. 32瑞萨电子推出ZSSC3240传感器信号调节器tech.sina.com.cn
  33. 33瑞萨推出 TS5111 温度传感器cieonline.co.uk
  34. 34瑞萨电子发布FSP v1.0更新tech.sina.com.cn
  35. 35瑞萨电子推出RX72N和RX66N MCU产品组tech.sina.com.cn
  36. 36瑞萨电子推出 RX23E-A 解决方案入门套件tech.sina.com.cn
  37. 37IAR Systems 更新 Renesas RL78 MCU 功能安全工具prnewswire.com
  38. 38瑞萨宣布推出 ISL70005SEH 电源稳压器eejournal.com
  39. 39瑞萨电子与赛灵思推出Versal ACAP参考设计解决方案tech.sina.com.cn
  40. 40Renesas 推出 RL78/G14 快速原型开发板eejournal.com
  41. 41瑞萨电子推出 RX23W 微控制器tech.sina.com.cn
  42. 42瑞萨推出 RA 微控制器系列eejournal.com
  43. 43半导体行业整合潮持续 瑞萨电子宣布59亿美元收购苹果供应商Dialog_个股资讯_市场_中金在线sc.stock.cnfol.com
  44. 44瑞萨电子加速ADAS和自动驾驶技术开发推出先进的R-Car V3U ASIL D级片上系统finance.sina.com.cn
  45. 45瑞萨电子推出16位通用RL78/G23, 扩充低功耗MCU RL78产品家族finance.sina.com.cn
  46. 46瑞萨电子推出符合JEDEC标准的精密温度传感器tech.sina.com.cn
  47. 47瑞萨电子推出符合JEDEC标准的精密温度传感器 适用于DDR5存储模块tech.sina.com.cn
  48. 48瑞萨电子推出集成LIN输出接口的传感器信号调理芯片 适用于电动/混动汽车HVAC系统tech.sina.com.cn
  49. 49瑞萨电子推出面向高性能服务器和云服务应用的DDR5数据缓冲器tech.sina.com.cn
  50. 50瑞萨电子推出全新车用执行器和传感器控制MCUfinance.sina.com.cn
  51. 51瑞萨电子推出全新低功耗RL78原型开发板 简化IoT终端设备原型设计tech.sina.com.cn
  52. 52瑞萨电子推出全新汽车摄像头解决方案finance.sina.com.cn
  53. 53瑞萨电子推出适用于工业与物联网应用的RA4M3 MCU产品群 扩展其Arm Cortex内核MCU产品家族finance.sina.com.cn
  54. 54瑞萨电子推出完整的电源和功能安全解决方案,适用于R-Car V3H ADAS摄像头系统finance.sina.com.cn
  55. 55瑞萨电子推出业界首款CMOS工艺集成化CDR 扩展其光通信产品组合,适用于PAM4应用finance.sina.com.cn
  56. 56瑞萨电子推出支持蓝牙5的32位MCU 扩充了基于Arm Cortex-M内核的RA产品家族tech.sina.com.cn
  57. 57瑞萨电子推出R-Car Gen3e CPU速度提升达20%finance.sina.com.cn
  58. 58瑞萨电子推出RZ/V系列微处理器 搭载图像处理AI加速器,可实现低功耗和实时AI处理tech.sina.com.cn
  59. 59瑞萨推出支持蓝牙5(Bluetooth 5)的RE01B微控制器(MCU)finance.sina.com.cn
  60. 60瑞薩擴大規模 擬斥近60億美元收購戴樂格news.cnyes.com
  61. 61LeddarTech Expands Renesas Collaborationbusinessghana.com
  62. 62Renesas Announces Buck-Boost DC/DC Converter with Ultra-Low Quiescent Current for Powering Sensors, MCUs, Wireless Devices, and Other Componentseejournal.com
  63. 63Renesas Completes Acquisition of Dialog Semiconductoriconnect007.com
  64. 64Renesas Electronics launches a new line of radiation-hardened devices for satellites | iTWireitwire.com
  65. 65Renesas Enters FPGA Market with the First Ultra-Low-Power, Low-Cost Family Addressing Low-Density, High-Volume Applicationseejournal.com
  66. 66Renesas Introduces Complete Power and Functional Safety Solution for R-Car V3H ADAS Camera Systems - CIEcieonline.co.uk
  67. 67Renesas Introduces JEDEC-Compliant Precision Temperature Sensor for DDR5 Memory Moduleseejournal.com
  68. 68Renesas Introduces RA6T2 MCUs for Next-Generation Motor Control in Inverter Appliances, Building Automation and Industrial Driveseejournal.com
  69. 69Renesas Introduces RX23E-A MCU Starter Kit to Jumpstart Accurate Analog Evaluation for Industrial Automation and Measurement Equipmenteejournal.com
  70. 70Renesas Launches Automotive Actuator and Sensor Control MCUs for Evolving Edge Applications in Next-Generation E/E Architectureeejournal.com
  71. 71Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on IoT Devices - CIEcieonline.co.uk
  72. 72Renesas Launches RX74M and RX74N Flagship 32-bit MCUs, First RX Family Built on 22nm Process and Featuring MRAMeejournal.com
  73. 73Renesas Unveils Integrated LIN Interface Sensor Signal Conditioner for Electric and Hybrid Electric Vehicle HVAC Systemseejournal.com

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