Recent events
Recent events tied to this brand in public sources.
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2026
SK Hynix announces shareholder return plan
SK Hynix said it will pursue shareholder returns totalling about 100 trillion won this year, including cash dividends, share repurchases and cancellations.
2026
SK Hynix reports record quarterly operating profit
SK Hynix reported operating profit of 83.3 trillion won for the July–September period, more than seven times the year-earlier figure and a record high.
2026
SK Hynix reports better-than-expected results and upbeat outlook
SK Hynix delivered better-than-expected results and an upbeat outlook, with projected shipment growth in the mid-20% range for the quarter.
2026
SK Hynix withdraws Solidigm IPO plans
SK Hynix said it was withdrawing plans for an IPO of its U.S.-based Solidigm unit, citing market volatility and share-price trends.
2026
SK hynix launches supplier financing program
SK hynix launched a 2 trillion won financing program with major commercial banks and the Korea Trade Insurance Corporation to help domestic semiconductor suppliers obtain affordable funding.
2026
SK Hynix's sixth-generation HBM4 back-end equipment orders reportedly delayed to next year, expansion pace below expectations
Insiders said that some back-end equipment orders for SK Hynix's sixth-generation HBM4 have been postponed to next year, indicating that the company's capacity expansion pace is below expectations.
2026
SK Hynix conditions new US factory on more US chip equipment exports to China, sources say
Reuters, citing sources, reports that SK Hynix has conditioned its plan for a new factory in the United States on the US allowing more chip equipment exports to China.
2026
SK Hynix unveils MARS memory acceleration architecture and HBF high-bandwidth flash technology
At the 2026 OCP Global Summit, SK Hynix announced its MARS memory acceleration architecture and HBF high-bandwidth flash technology, targeting memory bottlenecks in AI training and inference. Through memory disaggregation, MARS can improve first-token time (TTFT) for multi-turn inference by 3x to 5x; HBF offers bandwidth of about half of HBM with capacity up to 14x, with samples planned for early 2028. The two technologies are expected to optimize memory utilization and capacity configuration for AI infrastructure.
2026
SK Hynix unveils 3D Stacked DRAM architecture at SEDEX 2026, targeting 2028 mass production
At the 28th Korea Semiconductor Exhibition (SEDEX 2026) in Seoul, SK Hynix president and chief development officer Ahn Hyun formally disclosed a 3D Stacked DRAM architecture that bonds DRAM dies directly onto processor dies using Through-Silicon Via interconnects, eliminating the silicon interposer required by current High Bandwidth Memory. The company is targeting mass production in 2028 and is developing a 16-active-die configuration.
2026
SK Hynix unveils MARS and HBF memory technologies at 2026 OCP Global Summit
SK Hynix announced two memory technologies at the 2026 OCP Global Summit: MARS (Memory-Centric AI Rack-Scale System), a memory disaggregation architecture that the company said improves time-to-first-token by 3-5x in multi-turn AI inference scenarios, and HBF (High Bandwidth Flash), which provides about 14 times the capacity of HBM at roughly half its bandwidth, with HBF Cube samples planned for early 2028.
2026
SK Hynix unveils low-power processor design for SSD controllers
SK Hynix unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage bottlenecks as AI data centers demand faster and more efficient access to data.
2026
Applied Materials launches EPIC Center in Sunnyvale, California with $5 billion initial investment
Applied Materials launched its Equipment and Process Innovation and Commercialisation (EPIC) Center in Sunnyvale, California with an initial $5 billion capital investment. The 600,000-square-foot facility, featuring nearly four acres of advanced cleanroom space, opens with a founding roster of semiconductor majors including TSMC, Intel, SK Hynix, Micron and Samsung Electronics, alongside innovation partners Broadcom, Advantest, SCREEN, KIOXIA and Besi, and is designed to bring together chipmakers, systems companies, equipment vendors and university researchers to accelerate semiconductor process technology and equipment R&D.
2026
SK Hynix launches H-TPU processor architecture for SSDs
SK Hynix officially introduced its H-TPU (Hynix Transaction Processing Unit) processor architecture for SSDs on October 12, 2026, announced by SoC design vice president 구인재 in a keynote at the ISOCC 2026 conference in Songdo, Incheon, South Korea. The programmable architecture is dedicated to controlling the SSD data plane and processing transactions, splitting control functions into dozens of small TPU clusters instead of relying on a single large general-purpose CPU; per SK Hynix, its area is about 1/25 of a general CPU core (about 4% of total CPU area) and its power consumption about 2.5%. SK Hynix plans to apply the technology to its NAND memory product lines including next-generation enterprise SSD (eSSD) controllers and later its 'Storage Next' AI storage architecture.
2026
SK Hynix debuts CXL Hybrid Memory
SK Hynix debuted its CXL Hybrid Memory product at its OCP Global Summit booth. The product is built on XCENA's MX1 chip and pairs MX1-managed DDR5 with an SSD-backed memory tier.
2026
SK Hynix's Solidigm weighs IPO that could value the unit at up to $150 billion
Solidigm, the unit owned by SK Hynix, is weighing an initial public offering that sources say could value the unit at up to $150 billion, according to a Reuters exclusive.
2026
SK hynix Taobao flagship store delists all products and plans to close
The 'SKhynix flagship store' on Tmall announced it plans to voluntarily terminate operations on September 9, 2026, and has delisted all products. The store's operating entity is Tianjin Hailishi Technology Co., Ltd. Consumers are concerned about warranty service for previously purchased memory products. The change is confirmed only as the termination of a Taobao/Tmall store and does not equal SK hynix exiting the Chinese market.
2026
SK Hynix approves $28.6 billion share buyback and cancellation
SK Hynix approved a plan on Wednesday to repurchase and cancel 40 trillion won ($28.6 billion) of its own shares, the largest treasury share cancellation in the history of South Korean listed companies.
2026
SanDisk discloses HBF sample and mass production timeline
At a recent investor day, SanDisk disclosed that the first HBF (High Bandwidth Flash) samples are expected in 2027, with mass production targeted for 2028. HBF is a next-generation memory technology positioned between HBM and SSDs, combining HBM-level read bandwidth with 8-16x HBM capacity.
2022
SK hynix introduces next-generation PIM memory chip
SK hynix introduced a next-generation process-in-memory chip, which the article says processes data 16 times faster and consumes 80 percent less electricity.
2021
Intel completes first closing of NAND and SSD business sale to SK hynix
Intel completed the first closing of the sale of its SSD business and the Dalian NAND memory manufacturing facility to SK hynix for $7 billion. Intel will continue manufacturing NAND wafers at the facility until the transaction's final closing.