Recent events
Recent events tied to this brand in public sources.
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2026
TSMC seeks alternatives for factory equipment
Reuters reports that TSMC is seeking factory-equipment alternatives to reduce its vulnerability to China’s rare-earths grip, citing sources.
2026
TSMC reportedly set to complete 2027 production target early as 2nm capacity ramps toward 120,000 wafers per month
The report said that strong market demand for TSMC's 2nm process means the company is expected to complete its 2027 production target ahead of schedule, with 2nm capacity possibly reaching 120,000 wafers per month by year-end; the capacity increase was attributed to surging orders from tech giants including NVIDIA, AMD, Apple and Qualcomm.
2026
TSMC completes construction of second Arizona fab, mass production expected in Q3 2027
Alongside its third-quarter 2026 earnings disclosed on October 15, 2026, TSMC said it had completed construction of its second fab in Arizona and is installing equipment, with mass production expected to begin in the third quarter of 2027, slightly ahead of its previous schedule.
2026
TSMC expected to report sixth straight quarter of record profit
Reuters preview published on 2026-10-12 stated that TSMC is expected to report its sixth consecutive quarter of record profit, driven by the AI boom. The earnings report itself had not yet been released according to the source.
2026
Applied Materials launches EPIC Center in Sunnyvale, California with $5 billion initial investment
Applied Materials launched its Equipment and Process Innovation and Commercialisation (EPIC) Center in Sunnyvale, California with an initial $5 billion capital investment. The 600,000-square-foot facility, featuring nearly four acres of advanced cleanroom space, opens with a founding roster of semiconductor majors including TSMC, Intel, SK Hynix, Micron and Samsung Electronics, alongside innovation partners Broadcom, Advantest, SCREEN, KIOXIA and Besi, and is designed to bring together chipmakers, systems companies, equipment vendors and university researchers to accelerate semiconductor process technology and equipment R&D.
2026
Microsoft announces Maia 300 AI accelerator built on TSMC 2nm process
On October 12, 2026, Microsoft announced Maia 300, the third-generation Azure Maia AI accelerator, whose compute chiplets are manufactured on TSMC's N2P (2nm-class) process node, with mass-production deployment expected to begin in 2027. Microsoft said the chip is designed for long-context, latency-sensitive and multi-step agentic AI workloads, and projects 40% more tokens per megawatt than leading GPU systems and rack-level token throughput up to 7x that of Maia 200 in a full 96-accelerator configuration.
2026
TSMC reports September revenue up 54.6% year over year, third-quarter revenue of $16.03 billion
Taiwan Semiconductor Manufacturing reported September revenue growth of 54.6% year over year, pushing its third-quarter revenue to $16.03 billion, above expectations. Shares were down about 1% in early trading.
2026
TSMC reports Q3 2026 record revenue, first nine months exceed full-year 2025
On October 8, TSMC announced that its consolidated revenue for the first three quarters of 2026 was about NT$3,898.727 billion, up 41.1% year-on-year and surpassing its full-year 2025 revenue. September revenue was about NT$511.857 billion (down 0.6% month-on-month, up 54.6% year-on-year), and third-quarter revenue of about NT$1,494.243 billion (up 17.6% quarter-on-quarter, up 50.9% year-on-year) set a single-quarter record, attributed to strong AI demand and rising smartphone stocking demand.
2026
TSMC reports September net revenue up 54.6% year-over-year
Taiwan Semiconductor Manufacturing Co. (TSMC) disclosed September net revenue of NT$511.86 billion (US$16.03 billion), up 54.6% from a year earlier and down 0.6% from August, with third-quarter revenue of around NT$1.49 trillion. The company, a major beneficiary of surging demand for advanced AI chips, is scheduled to report its third-quarter earnings the following week.
2026
Musk says TSMC will not run Terafab AI chip complex
Per a Reuters report, Musk said that TSMC will not run Terafab's AI chip complex, meaning TSMC will not serve as operator of the facility.
2026
TSMC evaluates potential investment in Texas
According to a Reuters report citing sources, TSMC is evaluating a potential investment in Texas, United States. No commitment or terms have been announced.
2026
Xiaomi launches Xring O3 smartphone processor and completes development of Xring O100 and D100 chips
Xiaomi unveiled a new generation of in-house processors, including the Xring O3 smartphone processor announced on Monday, plus the AI-focused Xring O100 and autonomous-driving Xring D100 chips, all manufactured by TSMC. The Xring O3 is built on TSMC's 3-nanometre process and has entered mass production; the O100 and D100 have completed development and are set for deployment next year.
2026
Xiaomi launches self-developed Xring O3 mobile processor
Xiaomi released its new self-developed Xring O3 mobile processor, which two people familiar with the matter said will be manufactured by TSMC using a 3nm process and is expected to be used in Xiaomi's upcoming flagship foldable phone. Xiaomi confirmed the chip has entered mass production.
2026
Xiaomi unveils XRING O3 flagship mobile processor
Xiaomi unveiled its second-generation self-developed flagship system-on-chip, the XRING O3, on Aug. 24. The chip is manufactured on TSMC's 3-nanometer N3P process, is promoted as the world's first mobile processor to support LPDDR6 memory, and achieved an AnTuTu v11 benchmark score exceeding 5.22 million points. It will debut in the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max, both scheduled for release in September.
2026
Xiaomi unveils XRING O3 flagship SoC
Xiaomi officially introduced the XRING O3, a flagship system-on-chip built on TSMC's 3nm process with 24 billion transistors, a 10-core CPU peaking at 4.35 GHz and a 16-core GPU. Xiaomi claims roughly 60 percent higher multi-core performance than its predecessor with reduced power consumption, and the chip is positioned to reduce the company's reliance on third-party chipmakers such as Qualcomm.
2026
Waymo rolls out custom AI chip for its robotaxis
Alphabet's Waymo said it has built a custom ASIC chip, now in production in its latest robotaxi generation, to improve autonomous driving performance and diversify its chip supply beyond third-party suppliers such as Nvidia. The chip, made using TSMC's 5-nanometer process and capable of more than 1,000 TOPS, is being equipped in Waymo's robotaxi built with Zeekr.
2026
Cerebras launches CS-4 server rack with WSE-3 Turbo chip
Cerebras Systems announced the CS-4, a new server rack powered by three of its large chips and based on its Nexus server architecture, which the company says will speed AI chatbot queries. The system is available in the third quarter and the chips are fabricated with TSMC's 5-nanometer process.
2026
SoftBank Group sells 71.5% of its TSMC stake and buys Capital One and Life360 shares in Q2
SoftBank Group adjusted its equity portfolio in the second quarter, selling 1.4 million TSMC shares for about $269.8 million, roughly 71.5% of its TSMC holding, while newly buying 276,811 Capital One shares worth about $55.5 million and 10,718 Life360 shares worth about $488,500 as of the end of June, per its 13F filing.
2026
DRAM shortage delays chip packaging for iPhone 18
The article reports that DRAM supply is short and that wafers manufactured for Apple's A20 Pro chip are waiting for DRAM before they can proceed to packaging. It says TSMC is awaiting supply from Apple's DRAM suppliers, particularly Micron.
2022
QuickLogic announces eFPGA IP availability for TSMC 22nm
QuickLogic announced the availability of its first customer-defined eFPGA block targeting TSMC’s 22nm process node, generated by its Australis IP Generator.