Recent events
Recent events tied to this brand in public sources.
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2020
TSMC certifies Mentor products for its 3nm process
TSMC certified multiple Mentor product lines and tools for its 3nm (N3) process technology.
2020
Cadence unveils UltraLink D2D PHY IP
Cadence Design Systems unveiled UltraLink D2D PHY IP for Taiwan Semiconductor Manufacturing Company's 7-nanometer FinFET process technology.
2020
TSMC approves spending for advanced-process capacity expansion
TSMC's board approved NT$52.7 billion in spending for advanced-process capacity expansion and related investments.
2020
TSMC announces plans for a 4nm process node
TSMC announced that it would introduce a 4nm chip process as an extension of its 5nm process family, with mass production planned for 2022.
2020
TSMC expands foundry cooperation with Sony for image sensors
TSMC expanded its foundry cooperation with Sony for CMOS image sensors; the report says TSMC affiliate VisEra and supply-chain members would support the work, with new capacity planned.
2020
Moortec announces N5 distributed temperature sensor
Moortec announced a new distributed temperature sensor based on TSMC's N5 process technology as an addition to its embedded monitoring product portfolio.
2020
Mentor IC design tools receive TSMC N5 and N6 process certification
Mentor announced that its IC design tool suite had received certification for TSMC's N5 and N6 process technologies.
2020
SAMT enters TSMC supply chain
SAMT entered TSMC’s supply chain and supplies it with sputtering targets.
2020
Cadence tools certified for TSMC N6 and N5 process technologies
Cadence's digital full flow and custom/analog tool suites achieved Design Rule Manual and SPICE certification for TSMC's N6 and N5 process technologies.
2020
TSMC announces Arizona chip factory plan
Taiwan Semiconductor Manufacturing announced that it will build a US$12 billion chip factory in Arizona.
2020
TSMC introduces next-generation wafer-level IPD technology
A report says TSMC introduced its next-generation wafer-level integrated passive device (IPD) technology, which is intended for 5G mobile devices.
2020
Ansys RedHawk-SC certified for TSMC advanced process technologies
Ansys achieved certification for its RedHawk-SC power noise signoff platform across TSMC's advanced process technologies.
2020
TSMC stopped taking new Huawei orders
TSMC said it stopped taking new orders from Huawei in May, in compliance with U.S. sanctions.
2020
eMemory qualifies NeoMTP on TSMC's 0.18μm BCD process
eMemory announced that its NeoMTP non-volatile memory solution had been qualified on TSMC's Third-Generation 0.18μm BCD process for IoT power-management solutions.
2020
TSMC and Broadcom team up on 5nm development
TSMC joined forces with Broadcom to develop the advanced 5nm process and bolster TSMC’s CoWoS IC packaging platform supporting 5nm technology. TSMC said the cooperation would provide Broadcom services from IC packaging to pure wafer foundry services.
2020
TSMC and Broadcom launch a new CoWoS platform
TSMC and Broadcom launched a new-generation CoWoS platform, reported to have memory bandwidth of 2.7 TB/s.
2020
TSMC and Broadcom collaborate on enhanced CoWoS platform
TSMC announced that it would collaborate with Broadcom to introduce an enhanced CoWoS solution supporting an interposer twice the reticle size.
2020
TSMC releases fourth-quarter 2019 earnings
TSMC released its fourth-quarter 2019 financial results, reporting revenue of NT$317.237 billion and net profit of NT$116.035 billion.
2020
Ansys paper wins TSMC OIP Customers' Choice Award
Ansys received the Customers' Choice Award for a technical paper presented at TSMC's 2020 North America OIP Ecosystem Forum; conference attendees selected the paper by popular vote.
2019
ASM International receives TSMC Excellent Performance Award
ASM International received TSMC's Excellent Performance Award at the TSMC Supply Chain Management Forum in Taiwan, in recognition of its technology collaboration with TSMC.