Recent events
Recent events tied to this brand in public sources.
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2022
DENSO announces investment in JASM
TSMC announced that DENSO would invest $350 million in JASM, the Japan-based subsidiary established as a joint venture by TSMC and Sony Semiconductor Solutions, and was expected to obtain more than 10% of its equity.
2022
TSMC announces expanded JASM process offerings and capacity
TSMC announced that its planned Kumamoto plant would also offer 12/16-nanometer FinFET processes and increase monthly capacity to 55,000 12-inch wafers. The plant was planned to begin construction that year and target production by 2024.
2021
Unisoc launches second-generation 5G chip platform
Unisoc held an online launch event for its second-generation 5G chip platform, Tangula T770 and T760. The report also said customer products using the platform had reached mass production.
2021
TSMC and Sony announce Japan chip-factory project
TSMC and Sony Semiconductor Solutions announced a joint project to establish a semiconductor foundry subsidiary in Kumamoto, Japan, and build a factory. Sony was reported to invest about $500 million for less than a 20% stake; construction was planned to begin in 2022, with production targeted by the end of 2024.
2021
TSMC and Sony announce Japan wafer-fab joint venture
TSMC announced a joint venture with Sony to build a wafer manufacturing plant in Kumamoto, Japan, with an initial equipment investment of US$7 billion. The plant is planned to produce 22-to-28-nanometre chips and begin mass production by the end of 2024.
2021
proteanTecs receives TSMC OIP Partner of the Year award
proteanTecs announced that TSMC recognized it as the recipient of the 2021 OIP Partner of the Year award for Emerging IP Company.
2021
Synopsys and TSMC expand strategic technology collaboration
Synopsys announced that it expanded its strategic technology collaboration with TSMC to deliver system-integration capabilities for high-performance computing designs, using Synopsys' 3DIC Compiler platform with TSMC 3DFabric-based design methodologies.
2021
TSMC and Sony to build a factory in Kumamoto
TSMC announced that it would build a new factory in Kumamoto, Japan, together with Sony Group; the factory is planned to begin production in 2024.
2021
Fosun Industrial signs Taiwan vaccine sales agreement
Fosun Industrial signed an agreement to sell a total of 10 million doses of the mRNA COVID-19 vaccine to TSMC, Hon Hai and the Yongling Foundation for supply to Taiwan.
2021
TSMC introduces N5A automotive chip
TSMC introduced its N5A 5-nanometer automotive chip during its ongoing virtual technology symposium. The chip is designed for advanced automotive computing workloads and was undergoing industry-standard certification, with release planned for the third quarter of 2022.
2021
TSMC restores power at southern Taiwan manufacturing site
TSMC said power was restored at a major manufacturing site in southern Taiwan after an outage earlier that day. The company said it was evaluating the impact.
2021
Siengine announces plan to provide a new automotive chip
Siengine, the joint venture of ECARX Technology and Arm China, plans to begin providing a new chip product at the end of next year or in early 2023; TSMC is to manufacture the chips.
2021
Intel announces plans for 2023 CPU product lines
Intel disclosed development progress for its 7nm process and described its planned Meteor Lake desktop CPU and Granite Rapids server CPU lines, which the report says may launch in 2023. The report says the processors may be manufactured by TSMC.
2021
Cadence wins TSMC OIP Customers’ Choice Award
Cadence announced that it received a TSMC Open Innovation Platform Ecosystem Forum Customers’ Choice award for a paper about optimized digital design, implementation and signoff on TSMC’s N3 process.
2021
Apple and TSMC partner to develop micro OLED displays
Apple partnered with Taiwan Semiconductor Manufacturing Co (TSMC) to develop micro OLED displays intended for its upcoming augmented reality devices. The project was at the trial-production stage and was expected to take several years to reach mass production.
2021
Arasan launches second-generation MIPI D-PHY v1.1 IP
Arasan announced that its second-generation MIPI D-PHY v1.1 IP is available for TSMC 22nm process technology, with speeds up to 1.5 Gbps.
2021
Ansys receives 2021 TSMC OIP Partner of the Year awards
Ansys was recognized by TSMC with two 2021 OIP Partner of the Year awards, for joint development of 4nm design infrastructure and a 3DFabric design solution.
2020
TSMC cancels bulk discounts for major customers
TSMC cancelled its 3% discount for major customers on each 12-inch wafer. TSMC said the decision was intended to support a planned 20% increase in 5-nanometer capacity by the first half of 2021.
2020
TSMC plans production at two chip-packaging factories
A report said TSMC plans to put two chip-packaging factories into production over the next two years, using its 3D Fabric advanced packaging technology.
2020
TSMC decides to expand 5-nanometer capacity
The article reports that TSMC decided to increase 5-nanometer production capacity, with an additional 28,000 wafer starts in the fourth quarter and monthly capacity raised to nearly 90,000.